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SN65LVDS32 四路 LVDS 发送器

The SN55LVDS32, SN65LVDS32, SN65LVDS3486, and SN65LVDS9637 are differential line receivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four differential receivers provides a valid logical output state with a ±100-mV differential input voltage within the input common-mode voltage range. The input common-mode voltage range allows 1 V of ground potential difference between two LVDS nodes.

The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100

SN55LVDS31 SN65LVDM31 SN65LVDS047 SN65LVDS048A SN65LVDS31 SN65LVDS32 SN65LVDS33 SN65LVDS348 SN65LVDS352 SN65LVDS390 SN65LVDS391 SN75LVDS31
Input Signal LVTTL LVCMOS LVTTL LVDS LVTTL LVDS CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL LVDS LVTTL
Output Signal LVDS LVDM LVDS LVTTL LVDS LVTTL LVTTL LVTTL LVTTL LVTTL LVDS LVTTL
No. of Rx 4 4 4 4 4 4
No. of Tx 4 4 4 4 4 4 4
Signaling Rate(Mbps) 400 150 400 400 400 100 400 340 560 630 630 155
Supply Voltage(s)(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
ICC(Max)(mA) 35 40 26 15 35 18 23 20 20 18 26 35
Rx tpd(Typ)(ns) 2.9 2.3 4 4 4 2.6
Tx tpd(Typ)(ns) 1.7 2.3 1.8 1.7 1.7
Part-to-Part Skew(Max)(ps) 1000 1000 1000 800 1000 1000 1000 1000 1500 1000
Pin/Package 16CDIP, 16CFP, 20LCCC 16SOIC 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SO, 16SOIC, 16TSSOP 16SO, 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 24TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP
Operating Temperature Range(°C) -55 to 125 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 0 to 70
ESD HBM(kV) 8 12 8 10 8 8 15 15 15 15
Approx. Price (US$) 1.50 | 1ku 1.85 | 1ku 1.30 | 1ku 1.30 | 1ku 1.30 | 1ku 1.20 | 1ku 1.65 | 1ku 2.90 | 1ku 1.20 | 1ku 1.20 | 1ku 1.30 | 1ku
SN65LVDS32 特性
SN65LVDS32 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS32D ACTIVE -40 to 85 1.55 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS32DG4 ACTIVE -40 to 85 1.55 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS32DR ACTIVE -40 to 85 1.30 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS32DRG4 ACTIVE -40 to 85 1.30 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS32PW ACTIVE -40 to 85 1.55 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS32PWG4 ACTIVE -40 to 85 1.55 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS32PWR ACTIVE -40 to 85 1.30 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS32PWRG4 ACTIVE -40 to 85 1.30 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS32 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS32D Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32D SN65LVDS32D
SN65LVDS32DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32DG4 SN65LVDS32DG4
SN65LVDS32DR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32DR SN65LVDS32DR
SN65LVDS32DRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32DRG4 SN65LVDS32DRG4
SN65LVDS32PW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32PW SN65LVDS32PW
SN65LVDS32PWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32PWG4 SN65LVDS32PWG4
SN65LVDS32PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32PWR SN65LVDS32PWR
SN65LVDS32PWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS32PWRG4 SN65LVDS32PWRG4
SN65LVDS32 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS32 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)