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SN65LVDS047 具有直通式引脚的四路 LVDS 发送器

The SN65LVDS047 is a quad differential line driver that implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.

The intended application of this device and signaling technique is for point-to-point and multi-drop baseband data transmission over controlled impedance media of approximately 100 . The transmission media may be printed-circuit board traces, backplanes, or cables.

SN55LVDS31 SN65LVDM31 SN65LVDS047 SN65LVDS048A SN65LVDS31 SN65LVDS32 SN65LVDS33 SN65LVDS348 SN65LVDS352 SN65LVDS390 SN65LVDS391 SN75LVDS31
Input Signal LVTTL LVCMOS LVTTL LVDS LVTTL LVDS CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL LVDS LVTTL
Output Signal LVDS LVDM LVDS LVTTL LVDS LVTTL LVTTL LVTTL LVTTL LVTTL LVDS LVTTL
No. of Rx 4 4 4 4 4 4
No. of Tx 4 4 4 4 4 4 4
Signaling Rate(Mbps) 400 150 400 400 400 100 400 340 560 630 630 155
Supply Voltage(s)(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
ICC(Max)(mA) 35 40 26 15 35 18 23 20 20 18 26 35
Rx tpd(Typ)(ns) 2.9 2.3 4 4 4 2.6
Tx tpd(Typ)(ns) 1.7 2.3 1.8 1.7 1.7
Part-to-Part Skew(Max)(ps) 1000 1000 1000 800 1000 1000 1000 1000 1500 1000
Pin/Package 16CDIP, 16CFP, 20LCCC 16SOIC 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SO, 16SOIC, 16TSSOP 16SO, 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 24TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP
Operating Temperature Range(°C) -55 to 125 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 0 to 70
ESD HBM(kV) 8 12 8 10 8 8 15 15 15 15
Approx. Price (US$) 1.50 | 1ku 1.85 | 1ku 1.30 | 1ku 1.30 | 1ku 1.30 | 1ku 1.20 | 1ku 1.65 | 1ku 2.90 | 1ku 1.20 | 1ku 1.20 | 1ku 1.30 | 1ku
SN65LVDS047 特性
SN65LVDS047 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS047D ACTIVE -40 to 85 1.55 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS047DG4 ACTIVE -40 to 85 1.55 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS047DR ACTIVE -40 to 85 1.30 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS047DRG4 ACTIVE -40 to 85 1.30 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS047PW ACTIVE -40 to 85 1.55 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS047PWG4 ACTIVE -40 to 85 1.55 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS047PWR ACTIVE -40 to 85 1.30 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS047PWRG4 ACTIVE -40 to 85 1.30 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS047 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS047D Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047D SN65LVDS047D
SN65LVDS047DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047DG4 SN65LVDS047DG4
SN65LVDS047DR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047DR SN65LVDS047DR
SN65LVDS047DRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047DRG4 SN65LVDS047DRG4
SN65LVDS047PW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047PW SN65LVDS047PW
SN65LVDS047PWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047PWG4 SN65LVDS047PWG4
SN65LVDS047PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047PWR SN65LVDS047PWR
SN65LVDS047PWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS047PWRG4 SN65LVDS047PWRG4
SN65LVDS047 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS047 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)