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SN55LVDS31 四路 LVDS 发送器

The SN55LVDS31, SN65LVDS31, SN65LVDS3487, and SN65LVDS9638 are differential line drivers that implement the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as TIA/EIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the four current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.

The intended application of these devices and signaling technique is both point-to-point and multidrop (one driver and multiple receivers) data transmission over controlled impedance media of approximately 100 .

SN55LVDS31 SN65LVDM31 SN65LVDS047 SN65LVDS048A SN65LVDS31 SN65LVDS32 SN65LVDS33 SN65LVDS348 SN65LVDS352 SN65LVDS390 SN65LVDS391 SN75LVDS31
Input Signal LVTTL LVCMOS LVTTL LVDS LVTTL LVDS CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL LVDS LVTTL
Output Signal LVDS LVDM LVDS LVTTL LVDS LVTTL LVTTL LVTTL LVTTL LVTTL LVDS LVTTL
No. of Rx 4 4 4 4 4 4
No. of Tx 4 4 4 4 4 4 4
Signaling Rate(Mbps) 400 150 400 400 400 100 400 340 560 630 630 155
Supply Voltage(s)(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
ICC(Max)(mA) 35 40 26 15 35 18 23 20 20 18 26 35
Rx tpd(Typ)(ns) 2.9 2.3 4 4 4 2.6
Tx tpd(Typ)(ns) 1.7 2.3 1.8 1.7 1.7
Part-to-Part Skew(Max)(ps) 1000 1000 1000 800 1000 1000 1000 1000 1500 1000
Pin/Package 16CDIP, 16CFP, 20LCCC 16SOIC 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SO, 16SOIC, 16TSSOP 16SO, 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 24TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP
Operating Temperature Range(°C) -55 to 125 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 0 to 70
ESD HBM(kV) 8 12 8 10 8 8 15 15 15 15
Approx. Price (US$) 1.50 | 1ku 1.85 | 1ku 1.30 | 1ku 1.30 | 1ku 1.30 | 1ku 1.20 | 1ku 1.65 | 1ku 2.90 | 1ku 1.20 | 1ku 1.20 | 1ku 1.30 | 1ku
SN55LVDS31 特性
SN55LVDS31 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN55LVDS31W ACTIVE -55 to 125 16.83 | 100u CFP (W) | 16 1 | TUBE  
SNJ55LVDS31FK ACTIVE -55 to 125 22.55 | 100u LCCC (FK) | 20 1 | TUBE  
SNJ55LVDS31J ACTIVE -55 to 125 16.50 | 100u CDIP (J) | 16 1 | TUBE  
SNJ55LVDS31W ACTIVE -55 to 125 20.54 | 100u CFP (W) | 16 1 | TUBE  
SN55LVDS31 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN55LVDS31W TBD A42 N/A for Pkg Type SN55LVDS31W SN55LVDS31W
SNJ55LVDS31FK TBD POST-PLATE N/A for Pkg Type SNJ55LVDS31FK SNJ55LVDS31FK
SNJ55LVDS31J TBD A42 N/A for Pkg Type SNJ55LVDS31J SNJ55LVDS31J
SNJ55LVDS31W TBD A42 N/A for Pkg Type SNJ55LVDS31W SNJ55LVDS31W
SN55LVDS31 应用技术支持与电子电路设计开发资源下载
  1. SN55LVDS31 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)