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SN65LVDS250 2.0Gbps 4x4 交叉点交换器

The SN65LVDS250 and SN65LVDT250 are 4x4 nonblocking crosspoint switches in a flow-through pin-out allowing for ease in PCB layout. Low-voltage differential signaling (LVDS) is used to achieve a high-speed data throughput while using low power. Each of the output drivers includes a 4:1 multiplexer to allow any input to be routed to any output. Internal signal paths are fully differential to achieve the high signaling speeds while maintaining low signal skews. The SN65LVDT250 incorporates 110- termination resistors for those applications where board space is a premium.

The SN65LVDS250 and SN65LVDT250 are characterized for operation from –40°C to 85°C.

SN65LVCP202 SN65LVCP204 SN65LVCP22 SN65LVCP23 SN65LVCP402 SN65LVCP404 SN65LVDS122 SN65LVDS250
No. of Rx 2 4 2 2 2 4 2 4
No. of Tx 2 4 2 2 2 4 2 4
Signaling Rate(Mbps) 2500 2500 1000 1300 4250 4250 1500 2000
Supply Voltage(s)(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
ICC(Max)(mA) 115 220 85 65 110 220 100 145
Pin/Package 24VQFN 48VQFN 16SOIC, 16TSSOP 16SOIC, 16TSSOP 24VQFN 48VQFN 16SOIC, 16TSSOP 38TSSOP
Operating Temperature Range(°C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85
Peak-to-Peak Jitter(Max)(ps) 30 30 105 100 30 30 65 110
Output Signal VML VML LVDS LVPECL VML VML LVDS LVDS
Input Signal CML,VML CML,VML CML, LVDS, LVPECL CML, LVDS, LVPECL CML,VML CML,VML CML, LVDS, LVPECL CML, LVDS, LVPECL
Part-to-Part Skew(Max)(ps) 300 300 100 100 500 300 100 300
Rx tpd(Typ)(ns) 0.5 0.7 0.65 0.65 1 0.5 0.65 0.8
Tx tpd(Typ)(ns) 0.5 0.7 0.65 0.65 1 0.5 0.65 0.8
ESD HBM(kV) 4 3 5 5 3 3 4 3
Approx. Price (US$) 3.80 | 1ku 6.00 | 1ku 2.25 | 1ku 4.00 | 1ku 5.80 | 1ku 9.00 | 1ku 3.75 | 1ku 6.75 | 1ku
SN65LVDS250 特性
SN65LVDS250 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS250DBT ACTIVE -40 to 85 8.75 | 1ku TSSOP (DBT) | 38 50 | TUBE  
SN65LVDS250DBTG4 ACTIVE -40 to 85 8.75 | 1ku TSSOP (DBT) | 38 50 | TUBE  
SN65LVDS250DBTR ACTIVE -40 to 85 6.75 | 1ku TSSOP (DBT) | 38 2000 | LARGE T&R  
SN65LVDS250DBTRG4 ACTIVE -40 to 85 6.75 | 1ku TSSOP (DBT) | 38 2000 | LARGE T&R  
SN65LVDS250 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS250DBT Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS250DBT SN65LVDS250DBT
SN65LVDS250DBTG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS250DBTG4 SN65LVDS250DBTG4
SN65LVDS250DBTR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS250DBTR SN65LVDS250DBTR
SN65LVDS250DBTRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS250DBTRG4 SN65LVDS250DBTRG4
SN65LVDS250 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS250 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS/M-LVDS/ECL/CML选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)
SN65LVDS250 工具和软件
培训内容 型号 软件/工具类型
SN65LVDS125 评估模块 SN65LVDS125AEVM 开发电路板/EVM
SN65LVDS250 评估模块 SN65LVDS250EVM 开发电路板/EVM