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SN65LVCP23 2x2 交叉点交换器:LVPECL 输出

The SN65LVCP23 is a 2x2 LVPECL crosspoint switch. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVPECL drivers to provide high-speed operation. The SN65LVCP23 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2x2 switching, and LVDS/CML to LVPECL level translation on each channel. The flexible operation of the SN65LVCP23 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers an additional gigabit repeater/translator in the SN65LVDS101.

SN65LVCP202 SN65LVCP204 SN65LVCP22 SN65LVCP23 SN65LVCP402 SN65LVCP404 SN65LVDS122 SN65LVDS250
No. of Rx 2 4 2 2 2 4 2 4
No. of Tx 2 4 2 2 2 4 2 4
Signaling Rate(Mbps) 2500 2500 1000 1300 4250 4250 1500 2000
Supply Voltage(s)(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
ICC(Max)(mA) 115 220 85 65 110 220 100 145
Pin/Package 24VQFN 48VQFN 16SOIC, 16TSSOP 16SOIC, 16TSSOP 24VQFN 48VQFN 16SOIC, 16TSSOP 38TSSOP
Operating Temperature Range(°C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85
Peak-to-Peak Jitter(Max)(ps) 30 30 105 100 30 30 65 110
Output Signal VML VML LVDS LVPECL VML VML LVDS LVDS
Input Signal CML,VML CML,VML CML, LVDS, LVPECL CML, LVDS, LVPECL CML,VML CML,VML CML, LVDS, LVPECL CML, LVDS, LVPECL
Part-to-Part Skew(Max)(ps) 300 300 100 100 500 300 100 300
Rx tpd(Typ)(ns) 0.5 0.7 0.65 0.65 1 0.5 0.65 0.8
Tx tpd(Typ)(ns) 0.5 0.7 0.65 0.65 1 0.5 0.65 0.8
ESD HBM(kV) 4 3 5 5 3 3 4 3
Approx. Price (US$) 3.80 | 1ku 6.00 | 1ku 2.25 | 1ku 4.00 | 1ku 5.80 | 1ku 9.00 | 1ku 3.75 | 1ku 6.75 | 1ku
SN65LVCP23 特性
SN65LVCP23 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVCP23D ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVCP23DG4 ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVCP23DR ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVCP23DRG4 ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVCP23PW ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVCP23PWG4 ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVCP23PWR ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVCP23PWRG4 ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVCP23 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVCP23D Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23D SN65LVCP23D
SN65LVCP23DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23DG4 SN65LVCP23DG4
SN65LVCP23DR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23DR SN65LVCP23DR
SN65LVCP23DRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23DRG4 SN65LVCP23DRG4
SN65LVCP23PW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23PW SN65LVCP23PW
SN65LVCP23PWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23PWG4 SN65LVCP23PWG4
SN65LVCP23PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23PWR SN65LVCP23PWR
SN65LVCP23PWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVCP23PWRG4 SN65LVCP23PWRG4
SN65LVCP23 应用技术支持与电子电路设计开发资源下载
  1. SN65LVCP23 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS/M-LVDS/ECL/CML选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)
SN65LVCP23 工具和软件
培训内容 型号 软件/工具类型
SN65LVCP22 评估模块 SN65LVCP22-23EVM 开发电路板/EVM