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SN65LVDS122 2x2 1.5Gbps LVDS 交叉点交换器

The SN65LVDS122 and SN65LVDT122 are crosspoint switches that use low voltage differential signaling (LVDS) to achieve signaling rates as high as 1.5 Gbps. They are pin-compatible speed upgrades to the SN65LVDS22 and SN65LVDM22. The internal signal paths maintain differential signaling for high speeds and low signal skews. These devices have a 0 V to 4 V common-mode input range that accepts LVDS, LVPECL, CML inputs. Two logic pins (S0 and S1) set the internal configuration between the differential inputs and outputs. This allows the flexibility to perform the following configurations: 2 x 2 crosspoint switch, 2:1 mux, 1:2 splitter or dual repeater/translator within a single device. Additionally, SN65LVDT122 incorporates a 110- termination resistor for those applications where board space is a premium.

SN65LVDM22 SN65LVDS122 SN65LVDS22
No. of Rx 2 2 2
No. of Tx 2 2 2
Signaling Rate(Mbps) 250 1500 250
Supply Voltage(s)(V) 3.3 3.3 3.3
ICC(Max)(mA) 27 100 20
Pin/Package 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP
Operating Temperature Range(°C) -40 to 85 -40 to 85 -40 to 85
Peak-to-Peak Jitter(Max)(ps) 65
Output Signal LVDM LVDS LVDS
Input Signal LVDM CML, LVDS, LVPECL LVDS
Part-to-Part Skew(Max)(ps) 100
Rx tpd(Typ)(ns) 4 0.65 4
Tx tpd(Typ)(ns) 4 0.65 4
ESD HBM(kV) 12 4 12
Approx. Price (US$) 4.45 | 1ku 3.75 | 1ku 2.50 | 1ku
SN65LVDS122 特性
SN65LVDS122 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS122D ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS122DG4 ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS122DR ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS122DRG4 ACTIVE -40 to 85 2.25 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS122PW ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS122PWG4 ACTIVE -40 to 85 2.70 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS122PWR ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS122PWRG4 ACTIVE -40 to 85 2.25 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS122 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS122D Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122D SN65LVDS122D
SN65LVDS122DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122DG4 SN65LVDS122DG4
SN65LVDS122DR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122DR SN65LVDS122DR
SN65LVDS122DRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122DRG4 SN65LVDS122DRG4
SN65LVDS122PW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122PW SN65LVDS122PW
SN65LVDS122PWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122PWG4 SN65LVDS122PWG4
SN65LVDS122PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122PWR SN65LVDS122PWR
SN65LVDS122PWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS122PWRG4 SN65LVDS122PWRG4
SN65LVDS122 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS122 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS/M-LVDS/ECL/CML选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)
SN65LVDS122 工具和软件
培训内容 型号 软件/工具类型
SN65LVDS122 评估模块 SN65LVDS122EVM 开发电路板/EVM
SN65LVDS125 评估模块 SN65LVDS125AEVM 开发电路板/EVM
SN65LVDS250 评估模块 SN65LVDS250EVM 开发电路板/EVM