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SN65LVDS050 双路 LVDS 发送器/接收器

The SN65LVDS179, SN65LVDS180, SN65LVDS050, and SN65LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbps (see the Application Information section). The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100- load and receipt of 50-mV signals with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100- characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables

SN65LVDM050 SN65LVDM051 SN65LVDS049 SN65LVDS050 SN65LVDS051 SN65LVDS1050 SN65LVDS32B SN65LVDS33 SN65LVDT32B SN65LVDT33
Input Signal LVDM, LVTTL LVDM, LVTTL LVDS, LVTTL LVDS, LVTTL LVDS, LVTTL LVDS, LVTTL LVDS CMOS, ECL, LVCMOS, LVDS, LVECL, LVPECL, PECL LVDS LVDS, LVECL, LVPECL, PECL
Output Signal LVDM, LVTTL LVDM, LVTTL LVDS, LVTTL LVDS, LVTTL LVDS, LVTTL LVDS, LVTTL LVTTL LVTTL LVTTL LVTTL
No. of Rx 2 2 2 2 2 2 4 4 4 4
No. of Tx 2 2 2 2 2 2
Signaling Rate(Mbps) 500TX/100RX 500TX/100RX 400 400TX/100RX 400TX/100RX 400 400 400 400 400
Supply Voltage(s)(V) 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3 3.3
ICC(Max)(mA) 27 27 35 20 20 20 23 23 23 23
Rx tpd(Typ)(ns) 3.7 3.7 1.9 3.7 3.7 3.7 4 4 4 4
Tx tpd(Typ)(ns) 1.7 1.7 1.3 1.7 1.7 1.7
Part-to-Part Skew(Max)(ps) 1000 1000 1000 1000 1000 1000 1000
Pin/Package 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16TSSOP 16SOIC, 16TSSOP 16SOIC, 16TSSOP 16TSSOP 16SOIC 16SOIC, 16TSSOP 16SOIC 16SOIC, 16TSSOP
Operating Temperature Range(°C) -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85 -40 to 85
ESD HBM(kV) 12 12 10 12 12 12 15 15 15 15
Approx. Price (US$) 1.50 | 1ku 1.50 | 1ku 0.95 | 1ku 1.50 | 1ku 1.50 | 1ku 1.65 | 1ku 2.70 | 1ku 1.20 | 1ku 3.40 | 1ku 1.50 | 1ku
SN65LVDS050 特性
SN65LVDS050 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN65LVDS050D ACTIVE -40 to 85 1.80 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS050DG4 ACTIVE -40 to 85 1.80 | 1ku SOIC (D) | 16 40 | TUBE  
SN65LVDS050DR ACTIVE -40 to 85 1.50 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS050DRG4 ACTIVE -40 to 85 1.50 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN65LVDS050PW ACTIVE 1.80 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS050PWG4 ACTIVE 1.80 | 1ku TSSOP (PW) | 16 90 | TUBE  
SN65LVDS050PWR ACTIVE 1.50 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS050PWRG4 ACTIVE 1.50 | 1ku TSSOP (PW) | 16 2000 | LARGE T&R  
SN65LVDS050 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN65LVDS050D Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050D SN65LVDS050D
SN65LVDS050DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050DG4 SN65LVDS050DG4
SN65LVDS050DR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050DR SN65LVDS050DR
SN65LVDS050DRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050DRG4 SN65LVDS050DRG4
SN65LVDS050PW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050PW SN65LVDS050PW
SN65LVDS050PWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050PWG4 SN65LVDS050PWG4
SN65LVDS050PWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050PWR SN65LVDS050PWR
SN65LVDS050PWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN65LVDS050PWRG4 SN65LVDS050PWRG4
SN65LVDS050 应用技术支持与电子电路设计开发资源下载
  1. SN65LVDS050 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)