TQFP EXP PAD 封装形式产品选型表

Plastic: COG FBGA Isolated TO-220 Laminate CSP Laminate TCSP Laminate UCSP LBGA LLP LLP COL LQFP LQFP EXP PAD LTCC MDIP micro SMD micro SMDXT micro-ARRAY mini SOIC mini SOIC EXP PAD PLCC POS PQFP PSOP SC-70 SOIC narrow SOIC wide SOT-223 SOT-23 SSOP SSOP-EIAJ TEPBGA TO-220 TO-247 Single Gauge TO-252 TO-263 TO-263 THIN TO-92 TQFP TQFP EXP PAD TSOT TSSOP TSSOP EXP PAD UFBGA Hermetic: CCGA CERDIP CERPACK CQFP CQGP CSOP LCC SIDEBRAZE TO-100 TO-3 TO-39 TO-46 TO-5 TO-99 TO-PMOD Other: DIE WAFER

64-pins 100-pins

64-pins
Product Folder (Datasheet)	Description	Product Type	Package			Status
			Type	# pins	MSL/Lead-Free Availability
LMH6583YA	16x8 550 MHz Analog Crosspoint Switch, Gain of 2		TQFP EXP PAD (VXE64A)	64	Status	Full production
100-pins
Product Folder (Datasheet)	Description	Product Type	Package			Status
			Type	# pins	MSL/Lead-Free Availability
SCAN12100TYA	1228.8 and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration Measurement		TQFP EXP PAD (VXF100B)	100	Status	Full production
SCAN25100TYA	2457.6, 1228.8, and 614.4 Mbps CPRI SerDes with Auto RE Sync and Precision Delay Calibration Measurement		TQFP EXP PAD (VXF100B)	100	Status	Full production