Laminate UCSP 封装形式产品选型表

Plastic: COG FBGA Isolated TO-220 Laminate CSP Laminate TCSP Laminate UCSP LBGA LLP LLP COL LQFP LQFP EXP PAD LTCC MDIP micro SMD micro SMDXT micro-ARRAY mini SOIC mini SOIC EXP PAD PLCC POS PQFP PSOP SC-70 SOIC narrow SOIC wide SOT-223 SOT-23 SSOP SSOP-EIAJ TEPBGA TO-220 TO-247 Single Gauge TO-252 TO-263 TO-263 THIN TO-92 TQFP TQFP EXP PAD TSOT TSSOP TSSOP EXP PAD UFBGA Hermetic: CCGA CERDIP CERPACK CQFP CQGP CSOP LCC SIDEBRAZE TO-100 TO-3 TO-39 TO-46 TO-5 TO-99 TO-PMOD Other: DIE WAFER

20-pins 24-pins

20-pins
Product Folder (Datasheet)	Description	Status
LMX2430SLEX	3.0 GHz/0.8 GHz PLLatinum Dual High Frequency Synthesizer for RF Personal Communications	Full production
LMX2433SLEX	3.6 GHz/1.7 GHz PLLatinum Dual High Frequency Synthesizer for RF Personal Communications	Full production
LMX2434SLEX	5.0 GHz/2.5 GHz PLLatinum Low Power Dual Frequency Synthesizer for RF Personal Communications	Full production
24-pins
Product Folder (Datasheet)	Description	Status
LMX2470SLEX	2.6 GHz Delta-Sigma Fractional-N PLL with 800 MHz Integer-N PLL	Full production