TEPBGA 封装形式产品选型表

Plastic: COG FBGA Isolated TO-220 Laminate CSP Laminate TCSP Laminate UCSP LBGA LLP LLP COL LQFP LQFP EXP PAD LTCC MDIP micro SMD micro SMDXT micro-ARRAY mini SOIC mini SOIC EXP PAD PLCC POS PQFP PSOP SC-70 SOIC narrow SOIC wide SOT-223 SOT-23 SSOP SSOP-EIAJ TEPBGA TO-220 TO-247 Single Gauge TO-252 TO-263 TO-263 THIN TO-92 TQFP TQFP EXP PAD TSOT TSSOP TSSOP EXP PAD UFBGA Hermetic: CCGA CERDIP CERPACK CQFP CQGP CSOP LCC SIDEBRAZE TO-100 TO-3 TO-39 TO-46 TO-5 TO-99 TO-PMOD Other: DIE WAFER

292-pins

292-pins
Product Folder (Datasheet)	Description	Status
ADC10D1000CIUT	Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS A/D Converter	Full production
ADC10D1500CIUT	Low Power, 10-Bit, Dual 1.0/1.5 GSPS or Single 2.0/3.0 GSPS ADC	Full production
ADC12D1000CIUT	12-Bit, 2.0/3.2 GSPS Ultra High-Speed ADC	Preliminary
ADC12D1600CIUT	12-Bit, 2.0/3.2 GSPS Ultra High-Speed ADC	Preliminary
ADC12D1800CIUT	12-Bit, Single 3.6 GSPS ADC	Preliminary