| TS3USB30 | |
| Number of Channels | 2 | 
| ESD HBM(kV) | +/-2 | 
| Architecture | 1:2 Mux/Demux | 
| ron(max)(ohms) | 10 | 
| RON Mis-match(Max)(Ohms) | 0.35 | 
| RON Flatness(Max)(Ohms) | 2 | 
| Bandwidth(MHz) | 955 | 
| ICC(uA) | 1 | 
| IL OFF(Max)(nA) | 2 | 
| Charge Injection(Max)(pC) | N/A | 
| ON Time(Max)(ns) | 25 | 
| OFF Time(Max)(ns) | 30 | 
| tpd max(ns) | 0.25 | 
| Vcc range(V) | 3.0 to 4.3 | 
| Pin/Package | 10UQFN | 
ron   <0.35 | 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 | 
| TS3USB30RSWR | ACTIVE | -40 to 85 | 0.55 | 1ku | UQFN (RSE) | 10 | 3000 | LARGE T&R | 
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 | 
| TS3USB30RSWR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3USB30RSWR | TS3USB30RSWR |