TPIC1021A-Q1 汽车类 LIN 物理接口
The TPIC1021A is the Local Interconnect Network (LIN) physical interface, which integrates the serial transceiver with wake-up and protection features. The LIN bus is a single-wire bidirectional bus typically used for low-speed in-vehicle networks using data rates between
2.4 kbps and 20 kbps. The LIN protocol output data stream on TXD is converted by the TPIC1021A into the LIN bus signal through a current-limited wave-shaping driver as outlined by the LIN Physical Layer Specification Revision 2.0. The receiver converts the data stream from the LIN bus and outputs the data stream via RXD. The LIN bus has two states: dominant state (voltage near ground) and the recessive state (voltage near battery). In the recessive state, the LIN bus is pulled high by the TPIC1021A’s internal pullup resistor (30 k
) and series diode, so no external pullup components are required for slave applications.
|
TPIC1021A-Q1 |
| Spec Referenced |
LIN 2.0 |
| LIN Voltage(Min)(V) |
-40 |
| LIN Voltage(Max)(V) |
40 |
| Operating Voltage(Min)(V) |
7 |
| Operating Voltage(Max)(V) |
27 |
| ESD LIN (HBM)(kV) |
12 |
| LIN Bus Wake-up Capable |
Yes |
| External Wake-up Pin |
Yes |
| Dominant State Time-out Protection |
Yes |
| I/O Voltages for MCU(V) |
3.3, 5 |
TPIC1021A-Q1 特性
- LIN Physical Layer Specification Revision 2.0 Compliant and
Conforms to SAEJ2602 Recommended Practice for LIN
- LIN Bus Speed up to 20-kbps LIN Specified Maximum
- Sleep Mode: Ultralow Current Consumption, Allows Wake-Up
Events From LIN Bus, Wake-Up Input (External Switch), or Host MCU
- High-Speed Receive Capable
- ESD Protection to ±12 kV (Human-Body Model) on LIN Pin
- LIN Pin Handles Voltage From –40 V to 40 V
- Survives Transient Damage in Automotive Environment (ISO 7637)
- Extended Operation With Supply From 7 V to 27 V DC
(LIN Specification 7 V to 18 V)
- Interfaces to MCU With 5-V or 3.3-V I/O Pins
- Dominant State Timeout Protection
- Wake-Up Request on RXD Pin
- Control of External Voltage Regulator (INH Pin)
- Integrated Pullup Resistor and Series Diode for
LIN Slave Applications
- Low Electromagnetic Emission (EME), High
Electromagnetic Immunity (EMI)
- Bus Terminal Short Circuit Protected for Short to
Battery or Short to Ground
- Thermally Protected
- Ground Disconnection Fail Safe at System Level
- Ground Shift Operation at System Level
- Unpowered Node Does Not Disturb the Network
- Supports ISO9141 (K-Line)-Like Functions
TPIC1021A-Q1 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TPIC1021AQDRQ1 |
ACTIVE |
-40 to 125 |
0.40 | 1ku |
SOIC (D) | 8 |
2500 |
|
TPIC1021A-Q1 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TPIC1021AQDRQ1 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TPIC1021AQDRQ1 |
TPIC1021AQDRQ1 |
TPIC1021A-Q1 应用技术支持与电子电路设计开发资源下载
- TPIC1021A-Q1 数据资料 dataSheet 下载.PDF
- TI 德州仪器LIN 收发器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)