The TLV224x family of single-supply operational amplifiers offers very low   supply current of only 1 uA per channel. 
The low supply current is coupled with extremely low input bias currents   enabling them to be used with mega-
 resistors making   them ideal for portable, long active life, applications. DC accuracy is ensured   with a low typical offset voltage as low as 600 uV, CMRR of 100 dB, and minimum   open loop gain of 100 V/mV at 2.7 V.   
              
The maximum recommended supply voltage is as high as 12 V and ensured operation down to 2.5 V, with electrical characteristics specified at 2.7 V, 5 V and 12 V. The 2.5-V operation makes it compatible with Li-Ion battery-powered systems and many micropower microcontrollers available today including TI's MSP430
| TLV2244 | |
| Number of Channels | 4 | 
| Total Supply Voltage (V)(Min)(+5V=5, +/-5V=10) | 2.5 | 
| Total Supply Voltage (V)(Max)(+5V=5, +/-5V=10) | 12 | 
| Iq per channel(Max)(mA) | 0.0012 | 
| GBW(Typ)(MHz) | 0.0055 | 
| Slew Rate(Typ)(V/us) | 0.002 | 
| VIO (25 deg C)(Max)(mV) | 3 | 
| Offset Drift(Typ)(uV/C) | 3 | 
| IIB(Max)(pA) | 500 | 
| CMRR(Min)(dB) | 55 | 
| Vn at 1kHz(Typ)(nV/rtHz) | 500 | 
| Rail-Rail | In,Out | 
| Rating | Catalog | 
| Pin/Package | 14PDIP, 14SOIC, 14TSSOP | 
| Approx. Price (US$) | 1.10 | 1ku | 
| Operating Temperature Range(C) | -40 to 125,0 to 70 | 
| 器件 | 状态 | 温度 | 价格(美元) | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 | 
| TLV2244CD | ACTIVE | 0 to 70 | 1.10 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
| TLV2244CDG4 | ACTIVE | 0 to 70 | 1.10 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
| TLV2244ID | ACTIVE | -40 to 125 | 1.40 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
| TLV2244IDG4 | ACTIVE | -40 to 125 | 1.40 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
| TLV2244IDR | ACTIVE | -40 to 125 | 1.15 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
| TLV2244IDRG4 | ACTIVE | -40 to 125 | 1.15 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
| TLV2244IN | ACTIVE | -40 to 125 | 1.15 | 1ku | PDIP (N) | 14 | 25 | TUBE | |
| TLV2244INE4 | ACTIVE | -40 to 125 | 1.15 | 1ku | PDIP (N) | 14 | 25 | TUBE | |
| TLV2244IPW | ACTIVE | -40 to 125 | 1.40 | 1ku | TSSOP (PW) | 14 | 90 | TUBE | |
| TLV2244IPWG4 | ACTIVE | -40 to 125 | 1.40 | 1ku | TSSOP (PW) | 14 | 90 | TUBE | |
| TLV2244IPWR | ACTIVE | -40 to 125 | 1.15 | 1ku | TSSOP (PW) | 14 | 2000 | LARGE T&R | |
| TLV2244IPWRG4 | ACTIVE | -40 to 125 | 1.15 | 1ku | TSSOP (PW) | 14 | 2000 | LARGE T&R | 
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 | 
| TLV2244CD | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244CD | TLV2244CD | 
| TLV2244CDG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244CDG4 | TLV2244CDG4 | 
| TLV2244ID | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244ID | TLV2244ID | 
| TLV2244IDG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IDG4 | TLV2244IDG4 | 
| TLV2244IDR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IDR | TLV2244IDR | 
| TLV2244IDRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IDRG4 | TLV2244IDRG4 | 
| TLV2244IN | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | TLV2244IN | TLV2244IN | 
| TLV2244INE4 | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | TLV2244INE4 | TLV2244INE4 | 
| TLV2244IPW | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IPW | TLV2244IPW | 
| TLV2244IPWG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IPWG4 | TLV2244IPWG4 | 
| TLV2244IPWR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IPWR | TLV2244IPWR | 
| TLV2244IPWRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2244IPWRG4 | TLV2244IPWRG4 |