TIBPAL20L8-25C 低功耗高性能影响 PAL 电路
              
These programmable array logic devices feature high speed and functional   equivalency when compared with currently available devices. These IMPACTTM   circuits combine the latest Advanced Low-Power Schottky technology with proven   titanium-tungsten fuses to provide reliable, high-performance substitutes for   conventional TTL logic. Their easy programmability allows for quick design of   custom functions and typically results in a more compact circuit board. In   addition, chip carriers are available for further reduction in board space.
              All of the register outputs are set to a low level during power-up. Extra   circuitry has been provided to allow loading of each register asynchronously to   either a high or low state. This feature simplifies testing because the   registers can be set to an initial state prior to executing the test sequence
              
              TIBPAL20L8-25C 特性
              
              
                - Low-Power, High-Performance
                  
                      - Reduced ICC of 105 mA Max   
                      
 - fmax: 
                        Without Feedback . . . 33 MHz Min 
                        With Feedback . .   . 25 MHz Min   
                       - tpd . . . 25 ns Max
 
                  
                 - Direct Replacement for PAL20L8A, PAL20R4A, PAL20R6A, PAL20L8A, with 
                  at   Least 50% Reduction in Power   
                 - Preload Capability on Output Registers Simplifies Testing   
                
 - Power-Up Clear on Registered Devices (All Register Outputs are Set Low, 
                  but Voltage Levels at the 
                  Output Pins Go High)   
                 - Package Options Include Plastic Chip Carriers in Addition to Plastic and   Ceramic DIPs   
                
 - Dependable Texas Instruments Quality and Reliability
 
              
              TIBPAL20L8-25C 芯片订购指南
              
                
                  | 器件 | 
                  状态 | 
                  温度 | 
                  价格(美元) | 
                  封装 | 引脚 | 
                  封装数量 | 封装载体 | 
                  丝印标记 | 
                
                
                  | TIBPAL20L8-25CFN | 
                  ACTIVE | 
                  0 to 75 | 
                  2.37 | 1ku | 
                  PLCC (FN) | 28 | 
                  37 | TUBE | 
                    | 
                
                
                  | TIBPAL20L8-25CNT | 
                  ACTIVE | 
                  0 to 75 | 
                  2.37 | 1ku | 
                  PDIP (NT) | 24 | 
                  15 | TUBE | 
                    | 
                
              
              TIBPAL20L8-25C 质量与无铅数据
              
                
                  | 器件 | 
                  环保计划* | 
                  铅/焊球涂层 | 
                  MSL 等级/回流焊峰 | 
                  环保信息与无铅 (Pb-free) | 
                  DPPM / MTBF / FIT 率 | 
                
                
                  | TIBPAL20L8-25CFN | 
                  TBD  | 
                  CU SNPB  | 
                  Level-1-220C-UNLIM | 
                  TIBPAL20L8-25CFN | 
                  TIBPAL20L8-25CFN | 
                
                
                  | TIBPAL20L8-25CNT | 
                  Pb-Free (RoHS)  | 
                  CU NIPDAU  | 
                  N/A for Pkg Type | 
                  TIBPAL20L8-25CNT | 
                  TIBPAL20L8-25CNT | 
                
              
              TIBPAL20L8-25C 应用技术支持与电子电路设计开发资源下载
              
                - TIBPAL20L8-25C 数据资料   dataSheet 下载.PDF 
 
                - TI 德州仪器特殊逻辑产品选型与价格 . xls 
 
                - Shelf-Life Evaluation of Lead-Free Component Finishes  (PDF  1305 KB)
 
                - Understanding and Interpreting Standard-Logic Data Sheets  (PDF  857 KB)
 
                - TI IBIS File Creation, Validation, and Distribution Processes  (PDF  380 KB)
 
                - Implications of Slow or Floating CMOS Inputs  (PDF  101 KB)
 
                - CMOS Power Consumption and CPD Calculation  (PDF  89 KB)
 
                - Designing With Logic  (PDF  186 KB)
 
                - Live Insertion  (PDF  150 KB)
 
                - Input and Output Characteristics of Digital Integrated Circuits  (PDF  1708 KB)
 
                - Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc  (PDF  43 KB) 
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - LOGIC Pocket Data Book  (PDF  6001 KB)
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - Logic Cross-Reference (PDF  2938 KB)