TFP501 PanelBus HDCP 数字接收器
The TFP501 is a Texas Instruments PanelBus flat panel display product, part of a comprehensive family of end-to-end DVI 1.0-compliant solutions. Targeted primarily at desktop LCD monitors, DLP and LCD projectors, and digital TVs, the TFP501 finds applications in any design requiring high-speed digital interface with the additional benefit of an extremely robust and innovative encryption scheme for digital content protection.
The TFP501 supports display resolutions up to UXGA, including the standard HDTV formats, in 24-bit true color pixel format. The TFP501 offers design flexibility to drive one or two pixels per clock, supports TFT or DSTN panels, and provides an option for time staggered pixel outputs for reduced ground-bounce
|
TFP501 |
| Serial Data Receiver Channels |
3 |
| Number of Parallel Outputs |
48 |
| PLL Frequency(MHz) |
25 to 165 |
| Data Throughput(MB/s) |
495 |
| ICC(mA) |
400 |
| Operating Temperature Range(°C) |
0 to 70 |
| Supply Voltage(s)(V) |
3.3 |
| Pin/Package |
100HTQFP |
| Rating |
Catalog |
TFP501 特性
- Supports UXGA Resolution (Output Pixel Rates up to 165 MHz)
- Digital Visual Interface (DVI) and High-Bandwidth Digital Content Protection (HDCP) Specification Compliant1
- Encrypted External HDCP Device Key Storage for Exceptional Security and Ease of Implementation
- True-Color, 24 Bits/Pixel, 48-bit Dual Pixel Output Mode, 16.7M Colors at 1 or 2 Pixels Per Clock
- Laser Trimmed (50-
) Input Stage for Optimum Fixed Impedance Matching
- Skew Tolerant up to One Pixel Clock Cycle (High Clock and Data Jitter Tolerance)
- 4x Over-Sampling for Reduced Bit-Error Rates and Better Performance Over Longer Cables
- Reduced Power Consumption From 1.8-V Core Operation With 3.3-V I/O’s and Supplies2
- Reduced Ground-Bounce Using Time Staggered Pixel Outputs
- Lowest Noise and Best Power Dissipation Using TI 100-pin TQFP PowerPADTM Packaging
- Advanced Technology Using TI’s 0.18-um EPIC-5TM CMOS Process
- Supports Hot Plug Detection
TFP501 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TFP501PZP |
ACTIVE |
0 to 70 |
4.00 | 1ku |
HTQFP (PZP) | 100 |
90 | JEDEC TRAY (10+1) |
|
| TFP501PZPG4 |
ACTIVE |
0 to 70 |
4.00 | 1ku |
HTQFP (PZP) | 100 |
90 | JEDEC TRAY (10+1) |
|
TFP501 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TFP501PZP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TFP501PZP |
TFP501PZP |
| TFP501PZPG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TFP501PZPG4 |
TFP501PZPG4 |
TFP501 应用技术支持与电子电路设计开发资源下载
- TFP501 数据资料 dataSheet 下载.PDF
- TI 德州仪器PanelBus (DVI)选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- 使用 TI 的 TFP501 收发器改善 CAN 网络安全性 (zhct033.PDF, 299 KB)
- Isolated CAN Reference Design (PDF 48 KB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Isolated CAN EVM User's Guide (PDF 1168 KB)
- Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TFP501 工具与软件
| 培训内容 |
型号 |
软件/工具类型 |
| 通过 CAN 总线进行工业控制的演示平台 |
CANBUS-DEMO |
硬件参考设计 |