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SN75LVDS389 八位 LVDS 发送器

This family of four, eight, and sixteen differential line drivers implements the electrical characteristics of low-voltage differential signaling (LVDS). This signaling technique lowers the output voltage levels of 5-V differential standard levels (such as EIA/TIA-422B) to reduce the power, increase the switching speeds, and allow operation with a 3.3-V supply rail. Any of the sixteen current-mode drivers will deliver a minimum differential output voltage magnitude of 247 mV into a 100- load when enabled.

The intended application of this device and signaling technique is for point-to-point and multidrop baseband data transmission over controlled impedance media of approximately 100 . The transmission media can be printed-circuit board traces, backplanes, or cables.

SN75LVDS389
Input Signal LVTTL
Output Signal LVDS
No. of Rx 8
Signaling Rate(Mbps) 630
Supply Voltage(s)(V) 3.3
ICC(Max)(mA) 70
Rx tpd(Typ)(ns) 1.7
Part-to-Part Skew(Max)(ps) 1500
Pin/Package 38TSSOP
Operating Temperature Range(C) 0 to 70
ESD HBM(kV) 4
Approx. Price (US$) 2.00 | 1ku
SN75LVDS389 特性
SN75LVDS389 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN75LVDS389DBT ACTIVE 0 to 70 2.40 | 1ku TSSOP (DBT) | 38 50 | TUBE  
SN75LVDS389DBTG4 ACTIVE 0 to 70 2.40 | 1ku TSSOP (DBT) | 38 50 | TUBE  
SN75LVDS389DBTR ACTIVE 0 to 70 2.00 | 1ku TSSOP (DBT) | 38 2000 | LARGE T&R  
SN75LVDS389DBTRG4 ACTIVE 0 to 70 2.00 | 1ku TSSOP (DBT) | 38 2000 | LARGE T&R  
SN75LVDS389 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN75LVDS389DBT Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN75LVDS389DBT SN75LVDS389DBT
SN75LVDS389DBTG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN75LVDS389DBTG4 SN75LVDS389DBTG4
SN75LVDS389DBTR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN75LVDS389DBTR SN75LVDS389DBTR
SN75LVDS389DBTRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR SN75LVDS389DBTRG4 SN75LVDS389DBTRG4
SN75LVDS389 应用技术支持与电子电路设计开发资源下载
  1. SN75LVDS389 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器LVDS PHYs选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)