SN74LVTZ244 具有三态输出的 3.3V ABT 八路缓冲器/驱动器
SN74LVTZ244 描述
These octal buffers/drivers are designed specifically for low-voltage (3.3-V) VCC operation with the capability to provide a TTL interface to a 5-V system environment.
These devices are organized as two 4-bit line drivers with separate output-enable (
) inputs. When is low, the device passes data from the A inputs to the Y outputs. When is high, the outputs are in the high-impedance state.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN74LVTZ244 is available in TI's shrink small-outline package (DB), which provides the same I/O pin count and functionality of standard small-outline packages in less than half the printed-circuit-board area
| SN74LVTZ244 | |
| Voltage Nodes(V) | 3.3, 2.7 |
| Vcc range(V) | 2.7 to 3.6 |
| Logic | True |
| Input Level | TTL/CMOS |
| Output Level | LVTTL |
| Output Drive(mA) | -32/64 |
| No. of Outputs | 8 |
| tpd max(ns) | 4.1 |
| Static Current | 7.61 |
| Rating | Catalog |
SN74LVTZ244 特性
- State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
- High-Impedance State During Power Up and Power Down
- Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Support Unregulated Battery Operation Down to 2.7 V
- Typical VOLP (Output Ground Bounce)< 0.8 V at VCC = 3.3 V, TA = 25°C
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Bus-Hold Data Inputs Eliminate the Need for External Pullup Resistors
- Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), and Ceramic (J) DIPs
SN74LVTZ244 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74LVTZ244DW | ACTIVE | -40 to 85 | 0.60 | 1ku | SOIC (DW) | 20 | 25 | TUBE | LVTZ244 |
| SN74LVTZ244DWE4 | ACTIVE | -40 to 85 | 0.60 | 1ku | SOIC (DW) | 20 | 25 | TUBE | LVTZ244 |
| SN74LVTZ244DWG4 | ACTIVE | -40 to 85 | 0.60 | 1ku | SOIC (DW) | 20 | 25 | TUBE | LVTZ244 |
SN74LVTZ244 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74LVTZ244DW | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVTZ244DW | SN74LVTZ244DW |
| SN74LVTZ244DWE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVTZ244DWE4 | SN74LVTZ244DWE4 |
| SN74LVTZ244DWG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVTZ244DWG4 | SN74LVTZ244DWG4 |
SN74LVTZ244 应用技术支持与电子电路设计开发资源下载
- SN74LVTZ244 数据资料 dataSheet 下载.PDF
- TI 德州仪器缓冲器、驱动器/收发器产品选型与价格 . xls
- CMOS 非缓冲反向器在振荡器电路中的使用 (PDF 951 KB)
- Semiconductor Packing Methodology (PDF 3005 KB)
- 逻辑产品选择指南 2006/2007 （修订版 Z）(4462KB)
- 标准线性和逻辑产品 5 分钟指南 (786KB)
- 了解和解释标准逻辑数据表
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)