SN74AVC16722 具有三态输出的 22 位触发器
A Dynamic Output Control (DOC) circuit is implemented, which, during the transition, initially lowers the output impedance to effectively drive the load and, subsequently, raises the impedance to reduce noise. Figure 1 shows typical VOL vs IOL and VOH vs IOH curves to illustrate the output impedance and drive capability of the circuit. At the beginning of the signal transition, the DOC circuit provides a maximum dynamic drive that is equivalent to a high-drive standard-output device. For more information, refer to the TI application reports, AVC Logic Family Technology and Applications, literature number SCEA006, and Dynamic Output Control (DOCTM ) Circuitry Technology and Applications, literature number SCEA009.
|
SN74AVC16722 |
| Vcc range(V) |
1.4 to 3.6 |
| Output Drive(mA) |
-12/12 |
| No. of Outputs |
22 |
| No. of Bits |
22 |
| Static Current |
0.04 |
| th(ns) |
1.2 |
| tpd max(ns) |
2.6 |
| tsu(ns) |
2.5 |
| Logic |
True |
| Technology Family |
AVC |
| Rating |
Catalog |
SN74AVC16722 特性
- Member of the Texas Instruments WidebusTM Family
- EPICTM (Enhanced-Performance Implanted CMOS) Submicron Process
- DOCTM (Dynamic Output Control) Circuit Dynamically Changes Output Impedance, Resulting in Noise Reduction Without Speed Degradation
- Dynamic Drive Capability Is Equivalent to Standard Outputs With IOH and IOL of ±24 mA at 2.5-V VCC
- Overvoltage-Tolerant Inputs/Outputs Allow Mixed-Voltage-Mode Data Communications
- Ioff Supports Partial-Power-Down Mode Operation
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class I
- Packaged in Thin Shrink Small-Outline Package
SN74AVC16722 芯片订购指南
| 器件 |
状态 |
温度 |
价格（美元） |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| 74AVC16722DGGRE4 |
ACTIVE |
-40 to 85 |
4.10 | 1ku |
TSSOP (DGG) | 64 |
2000 | LARGE T&R |
AVC16722 |
| 74AVC16722DGGRG4 |
ACTIVE |
-40 to 85 |
4.10 | 1ku |
TSSOP (DGG) | 64 |
2000 | LARGE T&R |
AVC16722 |
| SN74AVC16722DGGR |
ACTIVE |
-40 to 85 |
4.10 | 1ku |
TSSOP (DGG) | 64 |
2000 | LARGE T&R |
AVC16722 |
SN74AVC16722 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| 74AVC16722DGGRE4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
74AVC16722DGGRE4 |
74AVC16722DGGRE4 |
| 74AVC16722DGGRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
74AVC16722DGGRG4 |
74AVC16722DGGRG4 |
| SN74AVC16722DGGR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
SN74AVC16722DGGR |
SN74AVC16722DGGR |
SN74AVC16722 应用技术支持与电子电路设计开发资源下载
- SN74AVC16722 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)