SN74ABTH16823 具有三态输出的 18 位总线接口触发器
       These 18-bit flip-flops feature 3-state outputs designed specifically for   driving highly capacitive or relatively low-impedance loads. They are   particularly suitable for implementing wider buffer registers, I/O ports,   bidirectional bus drivers with parity, and working registers. 
              The 'ABTH16823 can be used as two 9-bit flip-flops or one 18-bit flip-flop.   With the clock-enable (CLKEN\) input low, the D-type flip-flops enter data on   the low-to-high transitions of the clock. Taking CLKEN\ high disables the clock   buffer, latching the outputs. Taking the clear (CLR\) input low causes the Q   outputs to go low independently of the clock.   
              
A buffered output-enable (OE\) input can be used to place the nine outputs in   either a normal logic state (high or low logic levels) or a high-impedance state
              
              SN74ABTH16823 特性
              
              
                - Members of the Texas Instruments WidebusTM Family   
                
 - State-of-the-Art EPIC-II BTM BiCMOS   Design Significantly Reduces Power Dissipation   
                
 - ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V   Using Machine Model (C = 200 pF, R = 0)   
                
 - Typical VOLP (Output Ground Bounce) < 1 V at   VCC = 5 V, TA = 25°C   
                
 - High-Impedance State During Power Up and Power Down   
                
 - Distributed VCC and GND Pin Configuration Minimizes   High-Speed Switching Noise   
                
 - Flow-Through Architecture Optimizes PCB Layout   
                
 - High-Drive Outputs (-32-mA IOH, 64-mA   IOL)   
                
 - Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown   Resistors   
                
 - Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin   Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD)   Package Using 25-mil Center-to-Center Spacings
 
              
              SN74ABTH16823 芯片订购指南
              
                
                  | 器件 | 
                  状态 | 
                  温度 | 
                  价格(美元) | 
                  封装 | 引脚 | 
                  封装数量 | 封装载体 | 
                  丝印标记 | 
                
                
                  | SN74ABTH16823DGGR | 
                  ACTIVE | 
                  -40 to 85 | 
                  4.70 | 1ku | 
                  TSSOP (DGG) | 56 | 
                  2000 | LARGE T&R | 
                    | 
                
                
                  | SN74ABTH16823DLR | 
                  ACTIVE | 
                  -40 to 85 | 
                  5.15 | 1ku | 
                  SSOP (DL) | 56 | 
                  1000 | LARGE T&R | 
                    | 
                
              
              SN74ABTH16823 质量与无铅数据
              
                
                  | 器件 | 
                  环保计划* | 
                  铅/焊球涂层 | 
                  MSL 等级/回流焊峰 | 
                  环保信息与无铅 (Pb-free) | 
                  DPPM / MTBF / FIT 率 | 
                
                
                  | SN74ABTH16823DGGR | 
                  Green (RoHS & no Sb/Br)  | 
                  CU NIPDAU  | 
                  Level-1-260C-UNLIM | 
                  SN74ABTH16823DGGR | 
                  SN74ABTH16823DGGR | 
                
                
                  | SN74ABTH16823DLR | 
                  Green (RoHS & no Sb/Br)  | 
                  CU NIPDAU  | 
                  Level-1-260C-UNLIM | 
                  SN74ABTH16823DLR | 
                  SN74ABTH16823DLR | 
                
              
              SN74ABTH16823 应用技术支持与电子电路设计开发资源下载
              
                - SN74ABTH16823 数据资料   dataSheet 下载.PDF 
 
                - TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls 
 
                - Shelf-Life Evaluation of Lead-Free Component Finishes  (PDF  1305 KB)
 
                - Understanding and Interpreting Standard-Logic Data Sheets  (PDF  857 KB)
 
                - TI IBIS File Creation, Validation, and Distribution Processes  (PDF  380 KB)
 
                - Implications of Slow or Floating CMOS Inputs  (PDF  101 KB)
 
                - CMOS Power Consumption and CPD Calculation  (PDF  89 KB)
 
                - Designing With Logic  (PDF  186 KB)
 
                - Live Insertion  (PDF  150 KB)
 
                - Input and Output Characteristics of Digital Integrated Circuits  (PDF  1708 KB)
 
                - Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc  (PDF  43 KB) 
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - LOGIC Pocket Data Book  (PDF  6001 KB)
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - Logic Cross-Reference (PDF  2938 KB)