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CD74HCT173 具有三态输出的高速 CMOS 逻辑四路 D 类触发器

The ’HC173 and ’HCT173 high speed three-state quad Dtype flip-flops are fabricated with silicon gate CMOS technology. They possess the low power consumption of standard CMOS Integrated circuits, and can operate at speeds comparable to the equivalent low power Schottky devices. The buffered outputs can drive 15 LSTTL loads. The large output drive capability and three-state feature make these parts ideally suited for interfacing with bus lines in bus oriented systems.

The four D-type flip-flops operate synchronously from a common clock. The outputs are in the three-state mode when either of the two output disable pins are at the logic "1" level. The input ENABLES allow the flip-flops to remain in their present states without having to disrupt the clock If either of the 2 input ENABLES are taken to a logic "1" level, the Q outputs are fed back to the inputs, forcing the flip-flops to remain in the same state.

CD74HCT173
Technology Family HC
Rating Catalog
CD74HCT173 特性
CD74HCT173 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
CD74HCT173E ACTIVE -55 to 125 0.60 | 1ku PDIP (N) | 16 20 | TUBE  
CD74HCT173EE4 ACTIVE -55 to 125 0.60 | 1ku PDIP (N) | 16 20 | TUBE  
CD74HCT173M ACTIVE -55 to 125 0.65 | 1ku SOIC (DW) | 16 25 | TUBE  
CD74HCT173M96 ACTIVE -55 to 125 0.55 | 1ku SOIC (DW) | 16 2000 | LARGE T&R  
CD74HCT173M96E4 ACTIVE -55 to 125 0.55 | 1ku SOIC (DW) | 16 2000 | LARGE T&R  
CD74HCT173M96G4 ACTIVE -55 to 125 0.55 | 1ku SOIC (DW) | 16 2000 | LARGE T&R  
CD74HCT173ME4 ACTIVE -55 to 125 0.65 | 1ku SOIC (DW) | 16 25 | TUBE  
CD74HCT173MG4 ACTIVE -55 to 125 0.65 | 1ku SOIC (DW) | 16 25 | TUBE  
CD74HCT173 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
CD74HCT173E Pb-Free (RoHS) CU NIPDAU N/A for Pkg Type CD74HCT173E CD74HCT173E
CD74HCT173EE4 Pb-Free (RoHS) CU NIPDAU N/A for Pkg Type CD74HCT173EE4 CD74HCT173EE4
CD74HCT173M Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT173M CD74HCT173M
CD74HCT173M96 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT173M96 CD74HCT173M96
CD74HCT173M96E4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT173M96E4 CD74HCT173M96E4
CD74HCT173M96G4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT173M96G4 CD74HCT173M96G4
CD74HCT173ME4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT173ME4 CD74HCT173ME4
CD74HCT173MG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT173MG4 CD74HCT173MG4
CD74HCT173 应用技术支持与电子电路设计开发资源下载
  1. CD74HCT173 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
  3. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  4. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  5. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  6. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  7. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  8. Designing With Logic (PDF 186 KB)
  9. Live Insertion (PDF 150 KB)
  10. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  11. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  12. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  13. LOGIC Pocket Data Book (PDF 6001 KB)
  14. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  15. Logic Cross-Reference (PDF 2938 KB)