CD74HCT112 具有设置和复位功能的高速 CMOS 逻辑双路下降沿 J-K 触发器
              The ’HC112 and ’HCT112 utilize silicon-gate CMOS technology to achieve   operating speeds equivalent to LSTTL parts. They exhibit the low power   consumption of standard CMOS integrated circuits, together with the ability to   drive 10 LSTTL loads.
              These flip-flops have independent J, K, Set, Reset, and Clock inputs and Q   and Q\ outputs. They change state on the negative-going transition of the clock   pulse. Set and Reset are accomplished asynchronously by low-level inputs.
              The HCT logic family is functionally as well as pin-compatible with the   standard LS logic family
              
              CD74HCT112 特性
              
              
                - Hysteresis on Clock Inputs for Improved Noise Immunity and Increased Input   Rise and Fall Times   
                
 - Asynchronous Set and Reset   
                
 - Complementary Outputs   
                
 - Buffered Inputs   
                
 - Typical fMAX = 60MHz at VCC = 5V, CL =   15pF, TA = 25°C   
                
 - Fanout (Over Temperature Range)
                  
                      - Standard Outputs . . . . . 10 LSTTL Loads   
                      
 - Bus Driver Outputs . . . . . 15 LSTTL Loads
 
                  
                 - Wide Operating Temperature Range . . . –55°C to 125°C   
                
 - Balanced Propagation Delay and Transition Times   
                
 - Significant Power Reduction Compared to LSTTL Logic ICs   
                
 - HC Types
                  
                      - 2V to 6V Operation   
                      
 - High Noise Immunity: NIL = 30%, NIH = 30% of   VCC at VCC = 5V
 
                  
                 - HCT Types
                  
                      - 4.5V to 5.5V Operation   
                      
 - Direct LSTTL Input Logic Compatibility, VIL = 0.8V (Max),   VIH = 2V (Min)   
                      
 - CMOS Input Compatibility, Il 
 1uA at   VOL, VOH 
                  
                 
              
              CD74HCT112 芯片订购指南
              
                
                  | 器件 | 
                  状态 | 
                  温度 | 
                  价格 | 
                  封装 | 引脚 | 
                  封装数量 | 封装载体 | 
                  丝印标记 | 
                
                
                  | CD74HCT112E | 
                  ACTIVE | 
                  -55 to 125 | 
                  0.34 | 1ku | 
                  PDIP (N) |   14 | 
                  25 | TUBE | 
                  CD74HCT112E | 
                
                
                  | CD74HCT112EE4 | 
                  ACTIVE | 
                  -55 to 125 | 
                  0.34 | 1ku | 
                  PDIP (N) |   14 | 
                  25 | TUBE | 
                  CD74HCT112E | 
                
                
                  | CD74HCT112M96 | 
                  ACTIVE | 
                  -55 to 125 | 
                  0.31 | 1ku | 
                  SOIC (D) | 14 | 
                  2500 | LARGE T&R | 
                    | 
                
                
                  | CD74HCT112M96E4 | 
                  ACTIVE | 
                  -55 to 125 | 
                  0.31 | 1ku | 
                  SOIC (D) | 14 | 
                  2500 | LARGE T&R | 
                    | 
                
                
                  | CD74HCT112M96G4 | 
                  ACTIVE | 
                  -55 to 125 | 
                  0.31 | 1ku | 
                  SOIC (D) | 14 | 
                  2500 | LARGE T&R | 
                    | 
                
              
              CD74HCT112 质量与无铅数据
              
                
                  | 器件 | 
                  环保计划* | 
                  铅/焊球涂层 | 
                  MSL 等级/回流焊峰 | 
                  环保信息与无铅 (Pb-free) | 
                  DPPM / MTBF / FIT 率 | 
                
                
                  | CD74HCT112E | 
                  Pb-Free (RoHS)  | 
                  CU NIPDAU  | 
                  N/A for Pkg Type | 
                  CD74HCT112E | 
                  CD74HCT112E | 
                
                
                  | CD74HCT112EE4 | 
                  Pb-Free (RoHS)  | 
                  CU NIPDAU  | 
                  N/A for Pkg Type | 
                  CD74HCT112EE4 | 
                  CD74HCT112EE4 | 
                
                
                  | CD74HCT112M96 | 
                  Green (RoHS & no Sb/Br)  | 
                  CU NIPDAU  | 
                  Level-1-260C-UNLIM | 
                  CD74HCT112M96 | 
                  CD74HCT112M96 | 
                
                
                  | CD74HCT112M96E4 | 
                  Green (RoHS & no Sb/Br)  | 
                  CU NIPDAU  | 
                  Level-1-260C-UNLIM | 
                  CD74HCT112M96E4 | 
                  CD74HCT112M96E4 | 
                
              
              CD74HCT112 应用技术支持与电子电路设计开发资源下载
              
                - CD74HCT112 数据资料   dataSheet 下载.PDF 
 
                - TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls 
 
                - Shelf-Life Evaluation of Lead-Free Component Finishes  (PDF  1305 KB)
 
                - Understanding and Interpreting Standard-Logic Data Sheets  (PDF  857 KB)
 
                - TI IBIS File Creation, Validation, and Distribution Processes  (PDF  380 KB)
 
                - Implications of Slow or Floating CMOS Inputs  (PDF  101 KB)
 
                - CMOS Power Consumption and CPD Calculation  (PDF  89 KB)
 
                - Designing With Logic  (PDF  186 KB)
 
                - Live Insertion  (PDF  150 KB)
 
                - Input and Output Characteristics of Digital Integrated Circuits  (PDF  1708 KB)
 
                - Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc  (PDF  43 KB) 
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - LOGIC Pocket Data Book  (PDF  6001 KB)
 
                - HiRel Unitrode Power Management Brochure  (PDF  206 KB)
 
                - Logic Cross-Reference (PDF  2938 KB)