74AC16374 具有三态输出的 16 位边沿 D 类触发器
The 'AC16374 are 16-bit edge-triggered D-type flip-flops with 3-state outputs designed specifically for driving highly capacitive or relatively low-impedance loads. They are particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers.
The 'AC16374 can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock (CLK) input, the Q outputs of the flip-flop take on the logic levels set up at the data (D) inputs.
A buffered output-enable 
input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly
| 74AC16374 | |
| Voltage Nodes(V) | 5, 3.3 |
| Vcc range(V) | 3.0 to 5.5 |
| Input Level | CMOS |
| Output Level | CMOS |
| Output Drive(mA) | -24/24 |
| No. of Outputs | 16 |
| Static Current | 0.08 |
| th(ns) | 0 |
| tpd max(ns) | 10.8 |
| tsu(ns) | 5 |
| Logic | True |
| Technology Family | AC |
| Rating | Catalog |
74AC16374 特性
- Members of the Texas Instruments WidebusTM Family
- 3-State True Outputs
- Full Parallel Access for Loading
- Flow-Through Architecture Optimizes PCB Layout
- Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
- EPICTM (Enhanced-Performance Implanted CMOS) 1-
m Process
- 500-mA Typical Latch-Up Immunity at 125°C
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) Packages Using 25-mil Center-to-Center Pin Spacings and 380-mil Fine-Pitch Ceramic Flat (WD) Packages Using 25-mil Center-to-Center Pin Spacings
74AC16374 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| 74AC16374DL | ACTIVE | -40 to 85 | 1.75 | 1ku | SSOP (DL) | 48 | 25 | TUBE | |
| 74AC16374DLG4 | ACTIVE | -40 to 85 | 1.75 | 1ku | SSOP (DL) | 48 | 25 | TUBE | |
| 74AC16374DLR | ACTIVE | -40 to 85 | 1.45 | 1ku | SSOP (DL) | 48 | 1000 | LARGE T&R | |
| 74AC16374DLRG4 | ACTIVE | -40 to 85 | 1.45 | 1ku | SSOP (DL) | 48 | 1000 | LARGE T&R |
74AC16374 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| 74AC16374DL | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16374DL | 74AC16374DL |
| 74AC16374DLG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16374DLG4 | 74AC16374DLG4 |
| 74AC16374DLR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16374DLR | 74AC16374DLR |
| 74AC16374DLRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | 74AC16374DLRG4 | 74AC16374DLRG4 |
74AC16374 应用技术支持与电子电路设计开发资源下载
- 74AC16374 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)