UCC5619 用于快速和 Ultra SCSI 具有反向断开的 27 线路 5V SE 终端
UCC5619 provides 27 lines of active termination for a SCSI (Small Computer Systems Interface) parallel bus. The SCSI standard recommends active termination at both ends of the cable.
The UCC5619 is ideal for high performance 5V SCSI systems. During disconnect the supply current is typically only 100uA, which makes the IC attractive for lower powered systems.
The UCC5619 is designed with a low channel capacitance of 2.5pF, which eliminates effects on signal integrity from disconnected terminators at interim points on the bus.
The power amplifier output stage allows the UCC5619 to source full termination current and sink active negation current when all termination lines are actively negated.
The UCC5619, as with all Unitrode terminators, is completely hot pluggable and appears as high impedance at the teminating channels with VTRMPWR = 0V or open
| UCC5619 | |
| Number of Lines | 27 |
| Driver Types Supported | SE |
| TERMPWR Voltage(Min)(V) | 4 |
| TERMPWR Voltage(Max)(V) | 5.25 |
| Disconnect Active State | Low |
| Process | Bi-CMOS |
| Channel Capacitance(pF) | 3 |
| Resistor Tolerance(ppm) | 500 |
| Typical Sink Current(mA) | 300 |
| Current Tolerance(%) | 3 |
| Single-Ended Termination Impedance(ohms) | 110 |
| Single-Ended Tolerance(%) | 5 |
| Operating Temperature Range(C) | 0 to 70 |
| Pin/Package | 36SSOP |
UCC5619 特性
- Complies with SCSI, SCSI-2, SCSI-SPI and FAST-20 (Ultra) Standards
- 2.5pF Channel Capacitance during Disconnect
- 100uA Supply Current in Disconnect Mode
- 4V To 7V Operation
- 110
Termination
- Completely Meets SCSI Hot Plugging
- –900mA Sourcing Current for Termination
- +500mA Sinking Current for Active Negation
- Logic Command Disconnects all Termination Lines
- Trimmed Impedance to 5%
- Current Limit and Thermal Shutdown Protection
UCC5619 芯片订购指南
| 器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| UCC5619MWP | ACTIVE | 0 to 70 | 3.60 | 1ku | SSOP (DCE) | 36 | 25 | TUBE | |
| UCC5619MWPG4 | ACTIVE | 0 to 70 | 3.60 | 1ku | SSOP (DCE) | 36 | 25 | TUBE | |
| UCC5619MWPTR | ACTIVE | 0 to 70 | 3.10 | 1ku | SSOP (DCE) | 36 | 1000 | LARGE T&R | |
| UCC5619MWPTRG4 | ACTIVE | 0 to 70 | 3.10 | 1ku | SSOP (DCE) | 36 | 1000 | LARGE T&R |
UCC5619 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| UCC5619MWP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | UCC5619MWP | UCC5619MWP |
| UCC5619MWPG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | UCC5619MWPG4 | UCC5619MWPG4 |
| UCC5619MWPTR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | UCC5619MWPTR | UCC5619MWPTR |
| UCC5619MWPTRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | UCC5619MWPTRG4 | UCC5619MWPTRG4 |
UCC5619 应用技术支持与电子电路设计开发资源下载
- UCC5619 数据资料 dataSheet 下载.PDF
- TI 德州仪器SCSI 终端和收发器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
UCC5619 工具和软件
| 培训内容 | 型号 | 软件/工具类型 |
| UCC5619 评估模块 | UCC5619EVM | 开发电路板/EVM |