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UCC5606 具有反向关断功能的最低电容 9 线路 3-5V SE 端子,用于 SCSI 至 Ultra SCSI

The UCC5606 provides 9 lines of active termination for a small computer systems interface (SCSI) parallel bus. The SCSI standard recommends active termination at both ends of the cable segment.

The UCC5606 is ideal for high performance 3.3-V SCSI systems. The key features contributing to such low operating voltage are the 0.1-V drop out regulator and the 2.7-V reference. During disconnect the supply current is typically only 0.5 uA, which makes the device attractive for battery powered systems.

The UCC5606 is designed with an ultra-low channel capacitance of 1.8 pF, which eliminates effects on signal integrity from disconnected terminators at interim points on the bus.

The UCC5606 can be programmed for either a 110- termination is connected when the DISCNCT\ pin is driven high, and disconnected when driven low

UCC5606
Number of Lines 9
Driver Types Supported SE
TERMPWR Voltage(Min)(V) 2.7
TERMPWR Voltage(Max)(V) 5.25
Disconnect Active State Low
Process Bi-CMOS
Channel Capacitance(pF) 1.8
Resistor Tolerance(ppm) 500
Typical Sink Current(mA) 400
Current Tolerance(%) 4
Single-Ended Termination Impedance(ohms) 110
Single-Ended Tolerance(%) 7
Operating Temperature Range(C) 0 to 70
Pin/Package 16SOIC, 24TSSOP
UCC5606 特性
UCC5606 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
UCC5606DP ACTIVE 0 to 70 1.70 | 1ku SOIC (D) | 16 40 | TUBE  
UCC5606DPG4 ACTIVE 0 to 70 1.70 | 1ku SOIC (D) | 16 40 | TUBE  
UCC5606DPTR ACTIVE 0 to 70 1.55 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
UCC5606DPTRG4 ACTIVE 0 to 70 1.55 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
UCC5606J OBSOLETE 0 to 70 UTR | 16  
UCC5606PWP ACTIVE 0 to 70 1.70 | 1ku TSSOP (PW) | 24 60 | TUBE  
UCC5606PWPG4 ACTIVE 0 to 70 1.70 | 1ku TSSOP (PW) | 24 60 | TUBE  
UCC5606PWPTR ACTIVE 0 to 70 1.55 | 1ku TSSOP (PW) | 24 2000 | LARGE T&R  
UCC5606PWPTRG4 ACTIVE 0 to 70 1.55 | 1ku TSSOP (PW) | 24 2000 | LARGE T&R  
UCC5606 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
UCC5606DP Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606DP UCC5606DP
UCC5606DPG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606DPG4 UCC5606DPG4
UCC5606DPTR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606DPTR UCC5606DPTR
UCC5606DPTRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606DPTRG4 UCC5606DPTRG4
UCC5606PWP Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606PWP UCC5606PWP
UCC5606PWPG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606PWPG4 UCC5606PWPG4
UCC5606PWPTR Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606PWPTR UCC5606PWPTR
UCC5606PWPTRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UCC5606PWPTRG4 UCC5606PWPTRG4
UCC5606 应用技术支持与电子电路设计开发资源下载
  1. UCC5606 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器SCSI 终端和收发器选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
  5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
  6. 接口选择指南 (Rev. D) (PDF 2994 KB)
  7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
  8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Analog Signal Chain Guide (8.62 MB)
  12. Industrial Interface IC Solutions (101 KB)
UCC5606 工具和软件
培训内容 型号 软件/工具类型
UCC5606 评估模块 UCC5606EVM 开发电路板/EVM