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UC37133 高侧智能功率开关

UC37133 描述

The UC37131, UC37132 and UC37133 are a family of smart power switches which can drive resistive or inductive loads from the high side or low side. The UC37132 is available in 14 pin (DIP), 16 pin (SOIC), or 20 pin (CLCC) packages and can accommodate both low side (load to VCC) or high side (load to GND) configurations. The UC37131 and UC37133 are exclusively for a low side or a high side configuration respectively and both are available in an 8 pin package. Both high side and low side configurations provide high current switching with low saturation voltages which can drive resistive or inductive loads. The input to the switch is driven by a low voltage signal, typically 5V. Additionally, UC37132 features adjustable hysteresis.

UC27133 UC37133
No. of Outputs 1 1
Driver Configuration High Side High Side
VCC(Min)(V) 8 8
VCC(Max)(V) 65 65
Peak Output Current(A) 0.7 0.7
Rise Time(ns) 1000 1000
Fall Time(ns) 1000 1000
Prop Delay(ns) 3000 3000
Input Threshold CMOS, TTL CMOS, TTL
Rating Catalog Catalog
UC37133 特性
UC37133 芯片订购指南
器件 状态 温度 (oC) 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
UC37133D ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 8 75 | TUBE UC37133
UC37133DG4 ACTIVE -40 to 85 2.70 | 1ku SOIC (D) | 8 75 | TUBE UC37133
UC37133N ACTIVE -40 to 85 2.70 | 1ku PDIP (P) | 8 50 | TUBE UC37133N
UC37133NG4 ACTIVE -40 to 85 2.70 | 1ku PDIP (P) | 8 50 | TUBE UC37133N
UC37133 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
UC37133D Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC37133D UC37133D
UC37133DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR UC37133DG4 UC37133DG4
UC37133N Green (RoHS & no Sb/Br) CU NIPDAU N/A for Pkg Type UC37133N UC37133N
UC37133NG4 Green (RoHS & no Sb/Br) CU NIPDAU N/A for Pkg Type UC37133NG4 UC37133NG4
UC37133 应用技术支持与电子电路设计开发资源下载
  1. UC37133 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器NVSRAM(非易失性 SRAM)产品选型与价格 . xls
  3. PowerPADTM Thermally Enhanced Package (PDF 1040 KB)
  4. 全面认识开关型电源中的BUCK-BOOST功率级 (Rev. A) (PDF 2206 KB)
  5. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  6. PowerPADTM Made Easy (PDF 57 KB)
  7. 标准线性产品交叉参考 (Rev. D) (PDF 1058 KB)
  8. 模数规格和性能特性术语表 (Rev. A) (PDF 1993 KB)
  9. 所选封装材料的热学和电学性质 (PDF 645 KB)
  10. 高速数据转换 (PDF 1967 KB)
UC37133 相关工具
名称 型号 公司 工具/软件类型
UC37133 评估模块 UC37133EVM Texas Instruments 开发电路板/EVM