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TXS0206-29 具有 ESD 保护、EMI 滤波和 2.9V LDO 的 MMC、SD 卡、MemoryStick 电压转换

The TXS0206-29 is a complete solution for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory StickTM cards. It is comprised of a high-speed level translator, a low-dropout (LDO) voltage regulator, IEC level ESD protection, and EMI filtering circuitry.

The voltage-level translator has two supply voltage pins. VCCA can be operated over the full range of 1.1 V to 3.6 V. VCCB is set at 2.9 V and is supplied by an internal LDO. The integrated LDO accepts input voltages from 3.05 V to as high as 5.5 V and outputs 2.9 V, 200 mA to the B-side circuitry and to the external memory card. The TXS0206-29 enables system designers to easily interface low-voltage microprocessors to memory cards operating at 2.9 V.

Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206-29 incorporates ±8-kV Contact Discharge protection on the card side.

Since memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206-29 an ideal choice for these applications. The TXS0206-29 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings

TXS0206-29
Voltage Nodes(V) 1.2, 1.5, 1.8, 2.5, 3.3
Vcc range(V) 1.1 to 3.6
No. of Outputs 6
tpd max(ns) 4.7
Operating Temperature Range(°C) -40 to 85
Pin/Package 20DSBGA
TXS0206-29 特性
TXS0206-29 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
TXS0206-29YFPR ACTIVE -40 to 85 0.55 | 1ku DSBGA (YFF) | 20 3000 | LARGE T&R  
TXS0206-29 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TXS0206-29YFPR Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM TXS0206-29YFPR TXS0206-29YFPR
TXS0206-29 应用技术支持与电子电路设计开发资源下载
  1. TXS0206-29 数据资料 dataSheet 下载.PDF
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