TS3USB30 | |
Number of Channels | 2 |
ESD HBM(kV) | +/-2 |
Architecture | 1:2 Mux/Demux |
ron(max)(ohms) | 10 |
RON Mis-match(Max)(Ohms) | 0.35 |
RON Flatness(Max)(Ohms) | 2 |
Bandwidth(MHz) | 955 |
ICC(uA) | 1 |
IL OFF(Max)(nA) | 2 |
Charge Injection(Max)(pC) | N/A |
ON Time(Max)(ns) | 25 |
OFF Time(Max)(ns) | 30 |
tpd max(ns) | 0.25 |
Vcc range(V) | 3.0 to 4.3 |
Pin/Package | 10UQFN |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
TS3USB30RSWR | ACTIVE | -40 to 85 | 0.55 | 1ku | UQFN (RSE) | 10 | 3000 | LARGE T&R |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
TS3USB30RSWR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3USB30RSWR | TS3USB30RSWR |