TS3DV421 | |
ron(max)(ohms) | 20 |
ICC(uA) | 450 |
tpd max(ns) | 0.25 |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
TS3DV421DGVR | ACTIVE | -40 to 85 | 0.85 | 1ku | TVSOP (DGV) | 48 | 2000 | LARGE T&R | |
TS3DV421DGVRG4 | ACTIVE | -40 to 85 | 0.85 | 1ku | TVSOP (DGV) | 48 | 2000 | LARGE T&R | |
TS3DV421RUAR | ACTIVE | -40 to 85 | 0.85 | 1ku | WQFN (RUA) | 42 | 3000 | LARGE T&R |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
TS3DV421DGVR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3DV421DGVR | TS3DV421DGVR |
TS3DV421DGVRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TS3DV421DGVRG4 | TS3DV421DGVRG4 |
TS3DV421RUAR | TBD | Call TI | Call TI | TS3DV421RUAR | TS3DV421RUAR |