TPD2S017 具有串联电阻隔离的 2 通道超低钳位电压 ESD 解决方案

The TPD2S017 provides a robust system-level ESD solution for the high-speed lines interfacing low-voltage, ESD-sensitive core chipset. This device offers two stage ESD clamps in each line with 1- series resistor isolation. This architecture allows the device to generate very low clamp voltage during system level ESD strikes. Due to the series resistor component, the TPD2S017 provides a controlled filter roll-off for even greater spurious EMI suppression and signal integrity. This device offers a flow-through pin mapping for ease of board layout. The monolithic silicon technology allows matching component values, including clamp capacitance, series resistor matching, etc., between the differential signal pairs. Tight matching of the line capacitance and series resistors ensure that the differential signal distortion due to added ESD clamp remains minimal, and also allow the part to operate at high-speed differential data rate (in excess of 1.

	TPD2S017
Number of Channels	2
IEC 61000-4-2 Contact(+/- kV)	+/-11
IO Capacitance(Typ)(pF)	1
Differential Capacitance(pF)	0.02
Breakdown Voltage(Min)(V)	11
IO Leakage Current(nA)	10
Operating Temperature Range(°C)	-40 to 85

TPD2S017 特性

• Ultra-Low Clamp Voltage Ensures the Protection of Ultra-Low Voltage Core Chipset During ESD Events
• Exceeds ESD Protection to IEC61000-4-2 (Level 4)
• Matching of Series Resistor (R =1 ) of ±8 m (Typical)
• Differential Channel Input Capacitance Matching of 0.02 pF (Typical)
• High-Speed Data Rate and EMI Filter Action at High Frequencies (–3 dB Bandwidth, 3 GHz)
• Available in 6-Pin Small-Outline Transistor [SOT (DBV)] Package
• Flow-Through Single-In-Line Pin Mapping for the High-Speed Lines Ensures no Additional Board Layout Burden While Placing the ESD Protection Chip Near the Connector
• APPLICATIONS
  • Hi-Speed USB
  • IEEE 1394 Interface
  • Low-Voltage Differential Signaling (LVDS)
  • Mobile Display Digital Interface (MDDI)/Mobile Industry Processor Interface (MIPI)
  • HS Signal

TPD2S017 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
TPD2S017DBVR	ACTIVE	-40 to 85	0.14 | 1ku	SOT-23 (DBZ) | 3	3000 | LARGE T&R

TPD2S017 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TPD2S017DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	TPD2S017DBVR	TPD2S017DBVR

TPD2S017 应用技术支持与电子电路设计开发资源下载

1. TPD2S017 数据资料 dataSheet 下载.PDF
2. TI 德州仪器ESD 解决方案选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. 接口选择指南 (Rev. D) (PDF 2994 KB)
5. ESD Protection Guide (PDF 2885 KB)
6. Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
7. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
8. Isolated CAN Reference Design (PDF 48 KB)
9. Isolated RS-485 Reference Design (PDF 80 KB)
10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
11. Isolated CAN EVM User's Guide (PDF 1168 KB)
12. Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
13. Analog Signal Chain Guide (8.62 MB)
14. Industrial Interface IC Solutions (101 KB)