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TPD2E009 用于高速数据接口的 2 通道 ESD 保护阵列

The TPD2E009 provides 2 ESD clamp circuits with flow-through pin mapping for ease of board layout. This device has been designed to protect sensitive components which are connected to ultra high-speed data and transmission lines. The TPD2E009 offers protection from stress caused by ESD (electrostatic discharge). This device also offers 5 A (8/20 us) peak pulse current ratings per IEC 61000-4-5 (lightning) specification.

The monolithic silicon technology allows matching between the differential signal pairs. The less than differential 0.05-pF capacitance ensures that the differential signal distortion due to added ESD clamp remains minimal. The 0.7-pF line capacitance is suitable for high-speed data rate (in excess of 6 Gbps).

The TPD2E009 conforms to IEC61000-4-2 (Level 4) ESD protection. The DRT (1 mm × 1 mm) package is offered for space-saving portable applications. The industry standard DBZ (2.4 mm × 2.9 mm) package offers additional flexibility in the board layout for the system designer.

The TPD2E009 is characterized for operation over ambient air temperature range of –40°C to 85°C

TPD2E009
Number of Channels 2
IEC 61000-4-2 Contact(+/- kV) +/-8
IEC 61000-4-2 Air-Gap(+/- kV) +/-8
IO Capacitance(Typ)(pF) 0.7
Differential Capacitance(pF) 0.01
Breakdown Voltage(Min)(V) 9
IO Leakage Current(nA) 10
Operating Temperature Range(°C) -40 to 85
TPD2E009 特性
TPD2E009 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
TPD2E009DBZR ACTIVE -40 to 85 0.15 | 1ku SOT-23 (DBZ) | 3 3000 | LARGE T&R  
TPD2E009DRTR ACTIVE -40 to 85 0.15 | 1ku SOT (DRT) | 3 3000 | LARGE T&R  
TPD2E009DRYR PREVIEW -40 to 85 SON (DRY) | 6 5000 | LARGE T&R  
TPD2E009 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
TPD2E009DBZR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD2E009DBZR TPD2E009DBZR
TPD2E009DRTR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM TPD2E009DRTR TPD2E009DRTR
TPD2E009 应用技术支持与电子电路设计开发资源下载
  1. TPD2E009 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器ESD 解决方案选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 接口选择指南 (Rev. D) (PDF 2994 KB)
  5. ESD Protection Guide (PDF 2885 KB)
  6. Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
  7. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
  8. Isolated CAN Reference Design (PDF 48 KB)
  9. Isolated RS-485 Reference Design (PDF 80 KB)
  10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
  11. Isolated CAN EVM User's Guide (PDF 1168 KB)
  12. Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
  13. Analog Signal Chain Guide (8.62 MB)
  14. Industrial Interface IC Solutions (101 KB)