TPD2E007 用于 AC 信号数据接口的 2 通道 ESD 保护阵列
This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal integrity. The PicoStarTM package is intended to be embedded inside the printed circuit board which saves board space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to provide system level ESD protection for the valuable internal ICs while placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStarTM and 3-pin DCK packages
|
TPD2E007 |
| Number of Channels |
2 |
| IEC 61000-4-2 Contact(+/- kV) |
+/-8 |
| IEC 61000-4-2 Air-Gap(+/- kV) |
+/-15 |
| IO Capacitance(Typ)(pF) |
15 |
| Breakdown Voltage(Min)(V) |
+/-14 |
| IO Leakage Current(nA) |
50 |
| Operating Temperature Range(°C) |
-40 to 85 |
TPD2E007 特性
- ESD Protection Exceeds IEC61000-4-2
(Level 4)
- ±15-kV Human-Body Model (HBM)
- ±8-kV IEC 61000-4-2 Contact Discharge
- ±15-kV IEC 61000-4-2 Air-Gap Discharge
- 4.5-A Peak Pulse Current (8/20 ms Pulse)
- 15-pF Line to GND Capacitance
- Low 50-nA Leakage Current
- 2-Channel Device
- Space-Saving PicoStarTM and DCK Package
- APPLICATIONS
- Cell Phones, PDAs
- Audio Interface Connections
- Consumer Electronics (DVR, Set-Top Box, TV)
- Industrial Interface (RS-232, RS-485, RS-422, LVDS)
TPD2E007 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TPD2E007DCKR |
ACTIVE |
-40 to 85 |
0.20 | 1ku |
SC70 (DCK) | 3 |
3000 | LARGE T&R |
|
| TPD2E007YFMR |
PREVIEW |
-40 to 85 |
|
DSLGA (YFM) | 4 |
|
|
| TPD2E007YFMRG4 |
ACTIVE |
-40 to 85 |
0.20 | 1ku |
DSLGA (YFM) | 4 |
3000 | LARGE T&R |
|
TPD2E007 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TPD2E007DCKR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TPD2E007DCKR |
TPD2E007DCKR |
| TPD2E007YFMRG4 |
Green (RoHS & no Sb/Br) |
Call TI |
Level-1-260C-UNLIM |
TPD2E007YFMRG4 |
TPD2E007YFMRG4 |
TPD2E007 应用技术支持与电子电路设计开发资源下载
- TPD2E007 数据资料 dataSheet 下载.PDF
- TI 德州仪器ESD 解决方案选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- ESD Protection Guide (PDF 2885 KB)
- Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated CAN Reference Design (PDF 48 KB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Isolated CAN EVM User's Guide (PDF 1168 KB)
- Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)