TPD12S015 具有升压转换器、12C 电平转换器和高速 ESD 钳位的 HDMI 配套芯片
The TPD12S015 is an integrated HDMI ESD solution. The device pin mapping matches the HDMI Type C and Type D connector with four differential pairs. This device offers eight low-capacitance ESD clamps, allowing HDMI 1.3 data rates. The integrated ESD clamps and resistors provide good matching between each differential signal pair, which allows an advantage over discrete ESD clamp solutions where variations between ESD clamps degrade the differential signal quality.
The TPD12S015 provides a regulated 5 V output (5VOUT) for sourcing the HDMI power line. The regulated 5 V output supplies up to 55 mA to the HDMI receiver. The control of 5VOUT and the hot plug detect (HPD) circuitry is independent of the LS_OE control signal and is controlled by the CT_CP_HPD pin
|
TPD12S015 |
| Number of Channels |
12 |
| IEC 61000-4-2 Contact(+/- kV) |
+/-8 |
| IEC 61000-4-2 Air-Gap(+/- kV) |
1.3 |
| IO Capacitance(Typ)(pF) |
0.05 |
| Breakdown Voltage(Min)(V) |
9 |
| IO Leakage Current(nA) |
2500 |
| Operating Temperature Range(°C) |
-40 to 85 |
TPD12S015 特性
- HDMI 1.3 Data Rate
- HDMI High-Speed Differential Signals -3 dB Bandwidth Exceeds 6.4 Gbps
- Excellent Matching Capacitance (0.05 pF) in Each Differential Signal Pair
- Internal Boost Converter to Generate 5 V from a 2.3- to 5.5-V Battery Voltage
- HDMI Minimum Current Limit and Short-circuit Protection at 5VOUT Pin
- Flexible Power Saving Modes Through Seperate Control Pins
- Auto Direction Sensing Level Shifting in the CEC, SDA, SCL Lines Drive up to 750pF Load
- Seamless Type C and Type D Connector Routing with Flow-Through Pin Mapping
- IEC 61000-4-2 (Level 4) System Level ESD Compliance
- Integrated IOFF and Backdrive Current Protection
- Space-saving 1.6 mm × 2.8 mm WCSP (YFF) Package
- APPLICATIONS
- Smart Phones
- Multimedia Phones
- Digital Camcorders
- Digital Still Cameras
- Portable Game Consoles
TPD12S015 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TPD12S015YFFR |
ACTIVE |
-40 to 85 |
0.80 | 1ku |
DSBGA (YFF) | 28 |
3000 | LARGE T&R |
|
TPD12S015 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TPD12S015YFFR |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-1-260C-UNLIM |
TPD12S015YFFR |
TPD12S015YFFR |
TPD12S015 应用技术支持与电子电路设计开发资源下载
- TPD12S015 数据资料 dataSheet 下载.PDF
- TI 德州仪器ESD 解决方案选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- ESD Protection Guide (PDF 2885 KB)
- Reading and Understanding an ESD Protection Datasheet (PDF 2523 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated CAN Reference Design (PDF 48 KB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Isolated CAN EVM User's Guide (PDF 1168 KB)
- Energy Harvesting: Solar Solutions Guide (PDF 409 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)