TLV3501 采用 Microsize 封装的 4.5ns 轨至轨高速比较器
The TLV350x family of push-pull output comparators feature a fast 4.5ns propagation delay and operation from +2.7V to +5.5V. Beyond-the-rails input common-mode range makes it an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic.
Microsize packages provide options for portable and space-restricted applications. The single (TLV3501) is available in SOT23-6 and SO-8 packages. The dual (TLV3502) comes in the SOT23-8 and SO-8 packages
|
TLV3501 |
| Number of Channels |
1 |
| Iq per channel (Max) (mA) |
5 |
| tRESP Low - to - High (us) |
0.0045 |
| Output Type |
Push-Pull |
| VIO (25 deg C) (Max) (mV) |
6.5 |
| Rail-Rail |
In, Out |
| Pin/Package |
6SOT-23, 8SOIC |
| VICR (Min) (V) |
-0.2 |
| VICR (Max) (V) |
5.7 |
| # Comparators |
1 |
| Vs (Min) (V) |
2.2 |
| Vs (Max) (V) |
5.5 |
| Operating Temperature Range (C) |
-40 to 125 |
| Rating |
Catalog |
TLV3501 特性
- HIGH SPEED: 4.5ns
- RAIL-TO-RAIL I/O
- SUPPLY VOLTAGE: +2.7V to +5.5V
- PUSH-PULL CMOS OUTPUT STAGE
- SHUTDOWN (TLV3501 only)
- MICRO PACKAGES:
- LOW SUPPLY CURRENT: 3.2mA
- APPLICATIONS
- AUTOMATIC TEST EQUIPMENT
- WIRELESS BASE STATIONS
- THRESHOLD DETECTOR
- ZERO-CROSSING DETECTOR
- WINDOW COMPARATOR
TLV3501 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLV3501AID |
ACTIVE |
-40 to 125 |
1.20 | 1ku |
SOIC (D) | 8 |
75 | TUBE |
|
| TLV3501AIDBVR |
ACTIVE |
-40 to 125 |
1.00 | 1ku |
SOT-23 (DBV) | 6 |
3000 | LARGE T&R |
|
| TLV3501AIDBVRG4 |
ACTIVE |
-40 to 125 |
1.00 | 1ku |
SOT-23 (DBV) | 6 |
3000 | LARGE T&R |
|
| TLV3501AIDBVT |
ACTIVE |
-40 to 125 |
1.15 | 1ku |
SOT-23 (DBV) | 6 |
250 | SMALL T&R |
|
| TLV3501AIDBVTG4 |
ACTIVE |
-40 to 125 |
1.15 | 1ku |
SOT-23 (DBV) | 6 |
250 | SMALL T&R |
|
| TLV3501AIDG4 |
ACTIVE |
-40 to 125 |
1.20 | 1ku |
SOIC (D) | 8 |
75 | TUBE |
|
| TLV3501AIDR |
ACTIVE |
-40 to 125 |
1.00 | 1ku |
SOIC (D) | 8 |
2500 | LARGE T&R |
|
| TLV3501AIDRG4 |
ACTIVE |
-40 to 125 |
1.00 | 1ku |
SOIC (D) | 8 |
2500 | LARGE T&R |
|
TLV3501 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLV3501AID |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AID |
TLV3501AID |
| TLV3501AIDBVR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDBVR |
TLV3501AIDBVR |
| TLV3501AIDBVRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDBVRG4 |
TLV3501AIDBVRG4 |
| TLV3501AIDBVT |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDBVT |
TLV3501AIDBVT |
| TLV3501AIDBVTG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDBVTG4 |
TLV3501AIDBVTG4 |
| TLV3501AIDG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDG4 |
TLV3501AIDG4 |
| TLV3501AIDR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDR |
TLV3501AIDR |
| TLV3501AIDRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-2-260C-1 YEAR |
TLV3501AIDRG4 |
TLV3501AIDRG4 |
TLV3501 应用技术支持与电子电路设计开发资源下载
- TLV3501 数据资料 dataSheet 下载.PDF
- TI 德州仪器仪Comparator 比较器产品选型与价格 . xls
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- Operational Amplifier Macromodels: A Comparison (PDF 59 KB)