The TLV236x devices are high-performance dual operational amplifiers built using an original Texas Instruments bipolar process. These devices can be operated at a very low supply voltage (±1 V), while maintaining a wide output swing. The TLV236x devices offer a dramatically improved dynamic range of signal conditioning in low-voltage systems. The TLV236x devices also provide higher performance than other general-purpose operational amplifiers by combining higher unity-gain bandwidth and faster slew rate. With their low distortion and low-noise performance, these devices are well suited for audio applications.
TLV2362 | |
Iq per channel(Max)(mA) | 2.25 |
VIO (25 deg C)(Max)(mV) | 6 |
CMRR(Min)(dB) | 86 |
Vn at 1kHz(Typ)(nV/rtHz) | 9 |
Rail-Rail | Out |
IIB(Max)(pA) | 150000 |
Slew Rate(Min)(V/us) | 2.5 |
Slew Rate(Typ)(V/us) | 3 |
GBW(Typ)(MHz) | 6 |
Spec'd at Vs(V) | +/-2.5 |
VIO (Full Range)(Max)(mV) | 7.5 |
Vs(Min)(V) | 2 |
Vs(Max)(V) | 5 |
Pin/Package | 8PDIP, 8SOIC |
Vio(Max)(mV) | 7.5 |
Supply Voltage 5(V) | Yes |
Open Loop Gain(Min)(dB) | 60 |
IQ Per Amp (+/-)(Max)(mA) | 2.25 |
Offset Voltage (+/-)(Max)(mV) | 7.5 |
Number of Channels | 2 |
Approx. Price (US$) | 0.55 | 1ku |
Operating Temperature Range(C) | -40 to 85 |
Total Supply Voltage (V)(Min)(+5V=5, +/-5V=10) | 2 |
Total Supply Voltage (V)(Max)(+5V=5, +/-5V=10) | 5 |
器件 | 状态 | 温度 | 价格(美元) | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
TLV2362ID | ACTIVE | -40 to 85 | 0.70 | 1ku | SOIC (D) | 8 | 75 | TUBE | |
TLV2362IDE4 | ACTIVE | -40 to 85 | 0.70 | 1ku | SOIC (D) | 8 | 75 | TUBE | |
TLV2362IDG4 | ACTIVE | -40 to 85 | 0.70 | 1ku | SOIC (D) | 8 | 75 | TUBE | |
TLV2362IDR | ACTIVE | -40 to 85 | 0.55 | 1ku | SOIC (D) | 8 | 2500 | LARGE T&R | |
TLV2362IDRE4 | ACTIVE | -40 to 85 | 0.55 | 1ku | SOIC (D) | 8 | 2500 | LARGE T&R | |
TLV2362IDRG4 | ACTIVE | -40 to 85 | 0.55 | 1ku | SOIC (D) | 8 | 2500 | LARGE T&R | |
TLV2362IP | ACTIVE | -40 to 85 | 0.70 | 1ku | PDIP (P) | 8 | 50 | TUBE | |
TLV2362IPE4 | ACTIVE | -40 to 85 | 0.70 | 1ku | PDIP (P) | 8 | 50 | TUBE |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
TLV2362ID | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2362ID | TLV2362ID |
TLV2362IDE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2362IDE4 | TLV2362IDE4 |
TLV2362IDG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2362IDG4 | TLV2362IDG4 |
TLV2362IDR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2362IDR | TLV2362IDR |
TLV2362IDRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2362IDRE4 | TLV2362IDRE4 |
TLV2362IDRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | TLV2362IDRG4 | TLV2362IDRG4 |
TLV2362IP | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | TLV2362IP | TLV2362IP |
TLV2362IPE4 | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | TLV2362IPE4 | TLV2362IPE4 |