TLV2354 双路低电压 LinCMOS(TM) 差动比较器
The TLV2354 consists of four independent, low-power comparators specifically designed for single power-supply applications and operateS with power-supply rails as low as 2 V. When powered from a 3-V supply, the typical supply current is only 240 uA.
The TLV2354 is designed using the Texas Instruments LinCMOSTM technology and, therefore, features an extremely high input impedance (typically greater than 1012 ), which allows direct interfacing with high-impedance sources. The outputs are N-channel open-drain configurations that require an external pullup resistor to provide a positive output voltage swing, and they can be connected to achieve positive-logic wired-AND relationships. The TLV2354I is fully characterized for operation from - 40°C to 85°C
|
TLV2354 |
| Number of Channels |
4 |
| Iq per channel (Max) (mA) |
0.125 |
| Output Current (Min) (mA) |
6 |
| tRESP Low - to - High (us) |
0.2 |
| Output Type |
Open Collector, Open Drain |
| VIO (25 deg C) (Max) (mV) |
5 |
| Pin/Package |
14PDIP, 14SOIC, 14TSSOP |
| VICR (Min) (V) |
0 |
| VICR (Max) (V) |
6.75 |
| Vs (Min) (V) |
2 |
| Vs (Max) (V) |
8 |
| Operating Temperature Range (C) |
-40 to 85 |
| Rating |
Catalog |
TLV2354 特性
- Wide Range of Supply Voltages
2 V to 8 V
- Fully Characterized at 3 V and 5 V
- Very-Low Supply-Current Drain
120 uA Typ at 3V
- Output Compatible With TTL, MOS, and CMOS
- Fast Response Time . . . 200 ns Typ for TTL-Level Input Step
- High Input Impedance . . . 1012 Typ
- Extremely Low Input Bias Current
5 pA Typ
- Common-Mode Input Voltage Range Includes Ground
- Built-In ESD Protection
TLV2354 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLV2354ID |
ACTIVE |
-40 to 85 |
1.45 | 1ku |
SOIC (D) | 14 |
50 | TUBE |
|
| TLV2354IDG4 |
ACTIVE |
-40 to 85 |
1.45 | 1ku |
SOIC (D) | 14 |
50 | TUBE |
|
| TLV2354IDR |
ACTIVE |
-40 to 85 |
1.25 | 1ku |
SOIC (D) | 14 |
2500 | LARGE T&R |
|
| TLV2354IDRG4 |
ACTIVE |
-40 to 85 |
1.25 | 1ku |
SOIC (D) | 14 |
2500 | LARGE T&R |
|
| TLV2354IN |
ACTIVE |
-40 to 85 |
1.25 | 1ku |
PDIP (N) | 14 |
25 | TUBE |
|
| TLV2354INE4 |
ACTIVE |
-40 to 85 |
1.25 | 1ku |
PDIP (N) | 14 |
25 | TUBE |
|
| TLV2354IPW |
ACTIVE |
-40 to 85 |
1.45 | 1ku |
TSSOP (PW) | 14 |
90 | TUBE |
|
| TLV2354IPWG4 |
ACTIVE |
-40 to 85 |
1.45 | 1ku |
TSSOP (PW) | 14 |
90 | TUBE |
|
| TLV2354IPWR |
ACTIVE |
-40 to 85 |
1.25 | 1ku |
TSSOP (PW) | 14 |
2000 | LARGE T&R |
|
| TLV2354IPWRG4 |
ACTIVE |
-40 to 85 |
1.25 | 1ku |
TSSOP (PW) | 14 |
2000 | LARGE T&R |
|
TLV2354 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLV2354ID |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354ID |
TLV2354ID |
| TLV2354IDG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IDG4 |
TLV2354IDG4 |
| TLV2354IDR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IDR |
TLV2354IDR |
| TLV2354IDRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IDRG4 |
TLV2354IDRG4 |
| TLV2354IN |
Pb-Free (RoHS) |
CU NIPDAU |
N/A for Pkg Type |
TLV2354IN |
TLV2354IN |
| TLV2354INE4 |
Pb-Free (RoHS) |
CU NIPDAU |
N/A for Pkg Type |
TLV2354INE4 |
TLV2354INE4 |
| TLV2354IPW |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IPW |
TLV2354IPW |
| TLV2354IPWG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IPWG4 |
TLV2354IPWG4 |
| TLV2354IPWR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IPWR |
TLV2354IPWR |
| TLV2354IPWRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-1-260C-UNLIM |
TLV2354IPWRG4 |
TLV2354IPWRG4 |
TLV2354 应用技术支持与电子电路设计开发资源下载
- TLV2354 数据资料 dataSheet 下载.PDF
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