TLK4250 4 通道 1-2.5Gbps/通道 18 位收发器
The TLK4250 device is a four-channel, multi-gigabit transceiver used in high-speed bidirectional point-to-point data transmission systems. The four channels in the transceiver are configured as four separate links. The transceiver supports an effective serial interface speed of 1.0 Gbps to 2.5 Gbps per channel, providing up to 2.25 Gbps of data bandwidth per channel.
The primary application of the transceiver is to provide high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50 . The transmission media can be a printed-circuit board, copper cables, or fiber-optic cable. The maximum rate and distance of data transfer depend on the attenuation characteristics of the media and the noise coupling to the environment.
|
TLK4250 |
mW per Serial Channel |
450 |
Gbps per Serial Channel(Min) |
1 |
Gbps per Serial Channel(Max) |
2.5 |
ICC(Max)(mA) |
680 |
Power Consumption(Nom)(mW) |
1700 |
Number of Serial Channels |
4 |
Parallel Bus Width |
18 |
Serial I/F |
VML |
Parallel I/F |
LVTTL |
Operating Temperature Range(C) |
-40 to 85 |
Pin/Package |
289BGA |
VCC(Min)(V) |
2.3 |
VCC(Max)(V) |
2.7 |
VCC(Nom)(V) |
2.5 |
VIH(Min)(V) |
2 |
VIH(Max)(V) |
3.6 |
VIL(Max)(V) |
0.8 |
Vid(Min)(Vp-p) |
0.2 |
Vod(Min)(Vp-p) |
1 |
Vod(Max)(Vp-p) |
2.2 |
TLK4250 特性
- Hot Plug Protection
- Quad 1.0 to 2.5 Gigabits Per Second (Gbps) Serializer/Deserializer
- Independent Channel Operation
- 2.5-V Power Supply for Low Power Operation
- Selectable Signal Preemphasis for Serial Output
- Interfaces to Backplane, Copper Cables, or Optical Converters
- Lock Indication and Sync Mode for Fast Initialization
- 18-Bit Parallel Buses for Flexible Interface Applications
- On-Chip PLL Provides Clock Synthesis From Low-Speed Reference
- Receiver Differential Input Thresholds 200 mV Min
- Rated for Industrial Temperature Range
- Typical Power: 1700 mW at 2.5 Gbps
- Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link
- Internal Passive Receive Equalization
- Small Footprint 19 mm x 19 mm, 289-Ball PBGA Package
TLK4250 芯片订购指南
器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
TLK4250GPV |
PREVIEW |
-40 to 85 |
|
BGA (GPV) | 289 |
|
|
TLK4250IGPV |
ACTIVE |
|
30.00 | 1ku |
BGA (GPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
TLK4250IZPV |
ACTIVE |
-40 to 85 |
30.00 | 1ku |
BGA (ZPV) | 289 |
84 | JEDEC TRAY (10+1) |
|
TLK4250 质量与无铅数据
器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
TLK4250GPV |
TBD |
Call TI |
Level-3-220C-168 HR |
TLK4250GPV |
TLK4250GPV |
TLK4250IZPV |
Green (RoHS & no Sb/Br) |
SNAGCU |
Level-3-260C-168 HR |
TLK4250IZPV |
TLK4250IZPV |
TLK4250 应用技术支持与电子电路设计开发资源下载
- TLK4250 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK4250 工具和软件