TLK2501 1.5 至 2.5GBPS 收发器
The TLK2501 is a member of the transceiver family of multigigabit transceivers used in ultrahigh-speed bidirectional point-to-point data transmission systems. The TLK2501 supports an effective serial interface speed of 1.5 Gbps to 2.5 Gbps, providing up to 2 Gbps of data bandwidth. The TLK2501 is pin-for-pin compatible with the TLK2500. The TLK2501 is both pin-for-pin compatible with and functionally identical to the TLK1501, a 0.6 to 1.5 Gbps transceiver, and the TLK3101, a 2.5 to 3.125 Gbps transceiver, providing a wide range of performance solutions with no required board layout changes.
The primary application of this chip is to provide very high-speed I/O data channels for point-to-point baseband data transmission over controlled impedance media of approximately 50
|
TLK2501 |
| mW per Serial Channel |
360 |
| Gbps per Serial Channel(Min) |
1.5 |
| Gbps per Serial Channel(Max) |
2.5 |
| ICC(Max)(mA) |
145 |
| Power Consumption(Nom)(mW) |
362 |
| Number of Serial Channels |
1 |
| Parallel Bus Width |
16 |
| Serial I/F |
CML |
| Parallel I/F |
LVTTL |
| Operating Temperature Range(C) |
-40 to 85 |
| Pin/Package |
64HVQFP |
| VCC(Min)(V) |
2.3 |
| VCC(Max)(V) |
2.7 |
| VCC(Nom)(V) |
2.5 |
| VIH(Min)(V) |
1.7 |
| VIH(Max)(V) |
3.6 |
| VIL(Max)(V) |
0.8 |
| Vid(Min)(Vp-p) |
0.2 |
| Vod(Min)(Vp-p) |
1.68 |
| Vod(Max)(Vp-p) |
2.52 |
TLK2501 特性
- Hot-Plug Protection
- 1.5 to 2.5 Gigabits Per Second (Gbps) Serializer/Deserializer
- High-Performance 64-Pin VQFP Thermally Enhanced Package (PowerPADTM)
- 2.5-V Power Supply for Low Power Operation
- Programmable Voltage Output Swing on Serial Output
- Interfaces to Backplane, Copper Cables, or Optical Converters
- Rated for Industrial Temperature Range
- On-Chip 8-Bit/10-Bit (8B/10B) Encoding/Decoding, Comma Alignment, and Link Synchronization
- On-Chip PLL Provides Clock Synthesis From Low-Speed Reference
- Receiver Differential Input Thresholds 200 mV Minimum
- Typical Power: 360 mW
- Loss of Signal (LOS) Detection
- Ideal for High-Speed Backplane Interconnect and Point-to-Point Data Link
TLK2501 芯片订购指南
| 器件 |
状态 |
温度 |
价格 |
封装 | 引脚 |
封装数量 | 封装载体 |
丝印标记 |
| TLK2501IRCP |
ACTIVE |
-40 to 85 |
12.50 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (10+1) |
|
| TLK2501IRCPG4 |
ACTIVE |
-40 to 85 |
12.50 | 1ku |
HVQFP (RCP) | 64 |
160 | JEDEC TRAY (5+1) |
|
| TLK2501IRCPR |
ACTIVE |
-40 to 85 |
11.00 | 1ku |
HVQFP (RCP) | 64 |
1000 | LARGE T&R |
|
| TLK2501IRCPRG4 |
ACTIVE |
-40 to 85 |
11.00 | 1ku |
HVQFP (RCP) | 64 |
1000 | LARGE T&R |
|
TLK2501 质量与无铅数据
| 器件 |
环保计划* |
铅/焊球涂层 |
MSL 等级/回流焊峰 |
环保信息与无铅 (Pb-free) |
DPPM / MTBF / FIT 率 |
| TLK2501IRCP |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2501IRCP |
TLK2501IRCP |
| TLK2501IRCPG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2501IRCPG4 |
TLK2501IRCPG4 |
| TLK2501IRCPR |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2501IRCPR |
TLK2501IRCPR |
| TLK2501IRCPRG4 |
Green (RoHS & no Sb/Br) |
CU NIPDAU |
Level-3-260C-168 HR |
TLK2501IRCPRG4 |
TLK2501IRCPRG4 |
TLK2501 应用技术支持与电子电路设计开发资源下载
- TLK2501 数据资料 dataSheet 下载.PDF
- TI 德州仪器串行器和解串器选型与价格 . xls
- 所选封装材料的热学和电学性质 (PDF 645 KB)
- 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
- 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
- 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
- 接口选择指南 (Rev. D) (PDF 2994 KB)
- Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
- Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
- Isolated RS-485 Reference Design (PDF 80 KB)
- 无铅组件涂层的保存期评估 (PDF 1305 KB)
- Analog Signal Chain Guide (8.62 MB)
- Industrial Interface IC Solutions (101 KB)
TLK2501 工具和软件