TLK2201AJR 1.0 至 1.6Gbps 千兆以太网收发器

The TLK2201AJR is a member of the transceiver family of multigigabit transceivers, optimized for use with small form-factor optical transceivers that require footprints smaller than 14 mm. The TLK2201AJR gigabit ethernet transceiver is fully compliant with IEEE 802.3 requirements for serializer/deserializer functions at 1.25 Gbps. The TLK2201AJR supports a wide range of serial data rates from 1.0 Gbps to 1.6 Gbps.

The primary application of this device is to provide building blocks for point-to-point baseband data transmission over controlled impedance media of 50 . The transmission media can be printed-circuit board traces, copper cables, or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment

	TLK2201AJR
Gbps per Serial Channel(Min)	1
Gbps per Serial Channel(Max)	1.6
ICC(Max)(mA)	111
IIH(Max)(uA)	40
IIL(Max)(uA)	-40
Power Consumption(Nom)(mW)	200
Number of Serial Channels	1
Parallel Bus Width	10
Parallel I/F	LVTTL
Serial I/F	LVPECL
Operating Temperature Range(C)	0 to 70
Pin/Package	80BGA MICROSTAR JUNIOR
VCC(Min)(V)	2.3
VCC(Max)(V)	2.7
VCC(Nom)(V)	2.5
VIH(Min)(V)	1.7
VIH(Max)(V)	3.6
VIL(Max)(V)	0.8

TLK2201AJR 特性

• 1.0-to 1.6-Gigabits Per Second (Gbps) Serializer/Deserializer
• Low Power Consumption < 250 mW at 1.25 Gbps
• PECL Compatible Differential I/O on High-Speed Interface
• Single Monolithic PLL Design
• Support for 10-Bit Interface (TBI) or Reduced Interface 5-Bit Double Data Rate (DDR) Clocking
• Receiver Differential Input Thresholds 200 mV Minimum
• IEEE 802.3 (Gigabit Ethernet) Compliant
• Advanced 0.25-um CMOS Technology
• Interfaces to Backplane, Copper Cables, or Optical Modules
• No External Filter Capacitors Required
• Comprehensive Suite of Built-In Testability
• IEEE 1149.1 JTAG Support
• 2.5-V Supply for Lowest Power Operation
• 3.3-V Tolerant on TTL Inputs
• Hot Plug Protection
• ESD Protection 2-kV HBM
• 5 mm × 5 mm Footprint Remover Space Limitations With Small Form-Factor MicroStar JuniorTM BGA Packaging

TLK2201AJR 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
TLK2201AJRGQE	ACTIVE	0 to 70	3.95 | 1ku	BGA MICROSTAR JUNIOR (GQE) | 80	360 | JEDEC TRAY (10+1)
TLK2201AJRZQE	ACTIVE	0 to 70	3.95 | 1ku	BGA MICROSTAR JUNIOR (ZQE) | 80	360 | JEDEC TRAY (10+1)

TLK2201AJR 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
TLK2201AJRGQE	TBD	SNPB	Level-2A-235C-4 WKS	TLK2201AJRGQE	TLK2201AJRGQE
TLK2201AJRZQE	Green (RoHS & no Sb/Br)	SNAGCU	Level-3-260C-168 HR	TLK2201AJRZQE	TLK2201AJRZQE

TLK2201AJR 应用技术支持与电子电路设计开发资源下载

1. TLK2201AJR 数据资料 dataSheet 下载.PDF
2. TI 德州仪器串行器和解串器选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
5. 高性能SERDES及其在CPRI 接口的应用分析 (zhca076.HTM, 8 KB)
6. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
7. 接口选择指南 (Rev. D) (PDF 2994 KB)
8. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
9. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
10. Isolated RS-485 Reference Design (PDF 80 KB)
11. 无铅组件涂层的保存期评估 (PDF 1305 KB)
12. Analog Signal Chain Guide (8.62 MB)
13. Industrial Interface IC Solutions (101 KB)