TL16C550D | |
Number of Channels | 1 |
FIFOs(bytes) | 16 |
Operating Voltage(V) | 2.5, 3.3, 5 |
Operating Temperature Range(C) | -40 to 85,0 to 70 |
Pin/Package | 24BGA MICROSTAR JUNIOR, 32QFN, 48LQFP, 48TQFP |
Rating | Catalog |
Tx / Rx FIFO INT Trig | No / 4 Levels |
Auto RTS/CTS | Yes |
CPU Interface | X86 |
Baud Rate (max) at Vcc = 1.8V and with 16X Sampling(Mbps) | |
Baud Rate (max) at Vcc = 2.5V and with 16X Sampling(Mbps) | 1.0 |
Baud Rate (max) at Vcc = 3.3V and with 16X Sampling(Mbps) | 1.25 |
Baud Rate (max) at Vcc = 5.0V and with 16X Sampling(Mbps) | 1.5 |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
TL16C550DPT | ACTIVE | 0 to 70 | 1.60 | 1ku | LQFP (PT) | 48 | 250 | JEDEC TRAY (10+1) | |
TL16C550DPTG4 | ACTIVE | 0 to 70 | 1.60 | 1ku | LQFP (PT) | 48 | 250 | JEDEC TRAY (10+1) | |
TL16C550DPTR | ACTIVE | 0 to 70 | 1.30 | 1ku | LQFP (PT) | 48 | 1000 | LARGE T&R | |
TL16C550DPTRG4 | ACTIVE | 0 to 70 | 1.30 | 1ku | LQFP (PT) | 48 | 1000 | LARGE T&R |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
TL16C550DPT | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TL16C550DPT | TL16C550DPT |
TL16C550DPTG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TL16C550DPTG4 | TL16C550DPTG4 |
TL16C550DPTR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TL16C550DPTR | TL16C550DPTR |
TL16C550DPTRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-2-260C-1 YEAR | TL16C550DPTRG4 | TL16C550DPTRG4 |
培训内容 | 型号 | 软件/工具类型 |
TL16C550D 评估模块 | TL16C550DEVM | 开发电路板/EVM |
TL16C550D 评估模块 | TL16C550DEVM-002 | 开发电路板/EVM |
TL16C550D 评估模块 | TL16C550DEVM-004 | 开发电路板/EVM |