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THS3001 420MHz 电流反馈放大器

The THS3001 is a high-speed current-feedback operational amplifier, ideal for communication, imaging, and high-quality video applications. This device offers a very fast 6500-V/us slew rate, a 420-MHz bandwidth, and 40-ns settling time for large-signal applications requiring excellent transient response. In addition, the THS3001 operates with a very low distortion of –96 dBc, making it well suited for applications such as wireless communication basestations or ultrafast ADC or DAC buffers.


THS3001
Iq per channel(Max)(mA) 10
Slew Rate(Typ)(V/us) 6500
GBW(Typ)(MHz) 1750
Io(Typ)(mA) 120
Vs(Min)(V) 9
Vs(Max)(V) 32
Number of Channels 1
Pin/Package 8MSOP-PowerPAD, 8SOIC
Acl, min stable gain(V/V) 1
BW @ Acl(MHz) 420
Diff Gain(%) 0.01
Diff Phase(deg) 0.02
Vio(Max)(mV) 3
THD (Fc=1 MHz)(Typ)(dB) -96
Settling Time (0.1%)(Typ)(ns) 40
Offset Voltage Drift (+/-)(Max)(uV/Degrees Celsius) 5
Available Channels S
Vn at Flatband(Typ)(nV/rtHz) 1.6
Approx. Price (US$) 4.10 | 100u
Iib(Max)(nA) 15000
Noninverting Input Current Noise(pA/rtHz) 13
2nd Harmonic(dBc) 91
3rd Harmonic(dBc) 86
@ MHz 5
BW @ G=+2(MHz) 385
0.1 dB BW Flatness(MHz) 115
Inverting Input Current Noise(pA/rtHz) 16
Operating Temperature Range(C) -40 to 85,0 to 70
THS3001 特性
THS3001 芯片订购指南
器件 状态 温度 价格(美元) 封装 | 引脚 封装数量 | 封装载体 丝印标记
THS3001CD ACTIVE 0 to 70 4.90 | 100u SOIC (D) | 8 75 | TUBE  
THS3001CDG4 ACTIVE 0 to 70 4.90 | 100u SOIC (D) | 8 75 | TUBE  
THS3001CDGN ACTIVE 0 to 70 4.90 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001CDGNG4 ACTIVE 0 to 70 4.90 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001CDGNR ACTIVE 0 to 70 4.10 | 100u MSOP-PowerPAD (DGN) | 8 2500 | LARGE T&R  
THS3001CDGNRG4 ACTIVE 0 to 70 4.10 | 100u MSOP-PowerPAD (DGN) | 8 2500 | LARGE T&R  
THS3001CDR ACTIVE 0 to 70 4.10 | 100u SOIC (D) | 8 2500 | LARGE T&R  
THS3001CDRG4 ACTIVE 0 to 70 4.10 | 100u SOIC (D) | 8 2500 | LARGE T&R  
THS3001HVCDGN ACTIVE 0 to 70 8.05 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001HVCDGNG4 ACTIVE 0 to 70 8.05 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001HVIDGN ACTIVE -40 to 85 8.25 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001HVIDGNG4 ACTIVE -40 to 85 8.25 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001HVIDGNR ACTIVE -40 to 85 6.90 | 100u MSOP-PowerPAD (DGN) | 8 2500 | LARGE T&R  
THS3001HVIDGNRG4 ACTIVE -40 to 85 6.90 | 100u MSOP-PowerPAD (DGN) | 8 2500 | LARGE T&R  
THS3001ID ACTIVE 5.05 | 100u SOIC (D) | 8 75 | TUBE  
THS3001IDG4 ACTIVE 5.05 | 100u SOIC (D) | 8 75 | TUBE  
THS3001IDGN ACTIVE 5.05 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001IDGNG4 ACTIVE 5.05 | 100u MSOP-PowerPAD (DGN) | 8 80 | TUBE  
THS3001IDGNR ACTIVE 4.25 | 100u MSOP-PowerPAD (DGN) | 8 2500 | LARGE T&R  
THS3001IDGNRG4 ACTIVE 4.25 | 100u MSOP-PowerPAD (DGN) | 8 2500 | LARGE T&R  
THS3001IDR ACTIVE 4.25 | 100u SOIC (D) | 8 2500 | LARGE T&R  
THS3001IDRG4 ACTIVE 4.25 | 100u SOIC (D) | 8 2500 | LARGE T&R  
THS3001 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
THS3001CD Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CD THS3001CD
THS3001CDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDG4 THS3001CDG4
THS3001CDGN Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDGN THS3001CDGN
THS3001CDGNG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDGNG4 THS3001CDGNG4
THS3001CDGNR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDGNR THS3001CDGNR
THS3001CDGNRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDGNRG4 THS3001CDGNRG4
THS3001CDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDR THS3001CDR
THS3001CDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001CDRG4 THS3001CDRG4
THS3001HVCDGN Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001HVCDGN THS3001HVCDGN
THS3001HVCDGNG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001HVCDGNG4 THS3001HVCDGNG4
THS3001HVIDGN Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001HVIDGN THS3001HVIDGN
THS3001HVIDGNG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001HVIDGNG4 THS3001HVIDGNG4
THS3001HVIDGNR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001HVIDGNR THS3001HVIDGNR
THS3001HVIDGNRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001HVIDGNRG4 THS3001HVIDGNRG4
THS3001ID Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001ID THS3001ID
THS3001IDG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDG4 THS3001IDG4
THS3001IDGN Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDGN THS3001IDGN
THS3001IDGNG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDGNG4 THS3001IDGNG4
THS3001IDGNR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDGNR THS3001IDGNR
THS3001IDGNRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDGNRG4 THS3001IDGNRG4
THS3001IDR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDR THS3001IDR
THS3001IDRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM THS3001IDRG4 THS3001IDRG4
THS3001 应用技术支持与电子电路设计开发资源下载
  1. THS3001 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器仪运算放大器 (Op Amp)产品选型与价格 . xls
  3. 所选封装材料的热学和电学性质 (PDF 645 KB)
  4. 高速数据转换 (PDF 1967 KB)
  5. 在 PSPICE 中使用德州仪器 (TI) SPICE 模型 (zhca088.HTM, 8 KB)
  6. PowerPADTM Thermally Enhanced Package (slma002g.HTM, 8 KB)
  7. 运算放大器的单电源操作 (PDF 2174 KB)
  8. Tuning in Amplifiers (PDF 44 KB)
  9. Op Amp Performance Analysis (PDF 76 KB)
  10. An Error Analysis of the ISO102 in a Small Signal Measuring Application (PDF 29 KB)
  11. Level Shifting Signals with Differential Amplifiers (PDF 23 KB)
  12. Operational Amplifier Macromodels: A Comparison (PDF 59 KB)
THS3001 工具与软件
名称 型号 工具/软件类型
音频的快速搜索选择工具 AUDIO_SELECTION_TOOL 免费评估工具
THS3001 高速放大器评估模块 THS3001EVM 开发电路板/EVM
用于音频转换器的软件驱动程序 CODECDRIVERS-SW 应用软件