SN75LVDS051 高速差动线路驱动器和接收器

The SN75LVDS179, SN75LVDS180, SN75LVDS050, and SN75LVDS051 are differential line drivers and receivers that use low-voltage differential signaling (LVDS) to achieve signaling rates as high as 155 Mbps. The TIA/EIA-644 standard compliant electrical interface provides a minimum differential output voltage magnitude of 247 mV into a 100 load and receipt of 100 mV signals with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for point-to-point baseband data transmission over controlled impedance media of approximately 100 characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables

	SN75LVDS051
Output Signal	LVDS, LVTTL
No. of Rx	2
No. of Tx	2
Signaling Rate(Mbps)	155
Supply Voltage(s)(V)	3.3
ICC(Max)(mA)	20
Part-to-Part Skew(Max)(ps)	1000
Pin/Package	16SOIC
Operating Temperature Range(C)	0 to 70
Approx. Price (US$)	1.60 | 1ku

SN75LVDS051 特性

• Meets or Exceeds the Requirements of ANSI TIA/EIA-644-1995 Standard
• Signaling Rates up to 155 Mbps
• Operates From a Single 3.3-V Supply
• Low-Voltage Differential Signaling With Typical Output Voltages of 350 mV and a 100 Load
• LVTTL Input Levels are 5 V Tolerant
• Driver is High Impedance When Disabled or With VCC < 1.5 V
• Receiver has Open-Circuit Fail Safe
• Surface-Mount Packaging
  • D Package (SOIC)
• Characterized For Operation From 0°C to 70°C

SN75LVDS051 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN75LVDS051D	ACTIVE	0 to 70	1.55 | 1ku	SOIC (D) | 16	40 | TUBE
SN75LVDS051DG4	ACTIVE	0 to 70	1.55 | 1ku	SOIC (D) | 16	40 | TUBE

SN75LVDS051 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN75LVDS051D	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN75LVDS051D	SN75LVDS051D
SN75LVDS051DG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN75LVDS051DG4	SN75LVDS051DG4

SN75LVDS051 应用技术支持与电子电路设计开发资源下载

1. SN75LVDS051 数据资料 dataSheet 下载.PDF
2. TI 德州仪器LVDS PHYs选型与价格 . xls
3. 所选封装材料的热学和电学性质 (PDF 645 KB)
4. 使用数字隔离器设计隔离式 I2C 总线接口 (zhct119.PDF, 339 KB)
5. 1Q 2011 Issue Analog Applications Journal (slyt399.PDF, 964 KB)
6. 接口选择指南 (Rev. D) (PDF 2994 KB)
7. Signaling Rate vs. Distance for Differential Buffers (PDF 420 KB)
8. Q1 2009 Issue Analog Applications Journal (slyt319.PDF, 1.39 MB)
9. Isolated RS-485 Reference Design (PDF 80 KB)
10. 无铅组件涂层的保存期评估 (PDF 1305 KB)
11. Analog Signal Chain Guide (8.62 MB)
12. Industrial Interface IC Solutions (101 KB)