SN74LVTH574-EP 具有三态输出的增强型产品 3.3V Abt 八路边沿 D 类触发器
This octal flip-flop is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.
The eight flip-flops of the SN74LVTH574 are edge-triggered D-type flip-flops. On the positive transition of the clock (CLK) input, the Q outputs are set to the logic levels set up at the data (D) inputs.
A buffered output-enable (OE)\ input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components
| SN74LVTH574-EP | |
| Voltage Nodes(V) | 3.3, 2.7 |
| Vcc range(V) | 2.7 to 3.6 |
| Input Level | TTL/CMOS |
| Output Level | LVTTL |
| Output Drive(mA) | -32/+64 |
| No. of Bits | 8 |
| Static Current | 5 |
| th(ns) | 0.3 |
| tpd max(ns) | 4.5 |
| tsu(ns) | 2 |
| Logic | True |
| Technology Family | LVT |
| Rating | HiRel Enhanced Product |
SN74LVTH574-EP 特性
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree
- Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
- Supports Unregulated Battery Operation Down to 2.7 V
- Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C - Ioff and Power-Up 3-State Support Hot Insertion
- Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
- Latch-Up Performance Exceeds 500 mA Per JESD 17
- ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
SN74LVTH574-EP 芯片订购指南
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74LVTH574IPWREP | ACTIVE | -40 to 85 | 0.56 | 1ku | TSSOP (PW) | 20 | 2000 | LARGE T&R | |
| V62/04679-01XE | ACTIVE | -40 to 85 | 0.56 | 1ku | TSSOP (PW) | 20 | 2000 | LARGE T&R |
SN74LVTH574-EP 质量与无铅数据
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74LVTH574IPWREP | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVTH574IPWREP | SN74LVTH574IPWREP |
| V62/04679-01XE | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | V62/04679-01XE | V62/04679-01XE |
SN74LVTH574-EP 应用技术支持与电子电路设计开发资源下载
- SN74LVTH574-EP 数据资料 dataSheet 下载.PDF
- TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
- Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
- Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
- TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
- Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
- CMOS Power Consumption and CPD Calculation (PDF 89 KB)
- Designing With Logic (PDF 186 KB)
- Live Insertion (PDF 150 KB)
- Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
- Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- LOGIC Pocket Data Book (PDF 6001 KB)
- HiRel Unitrode Power Management Brochure (PDF 206 KB)
- Logic Cross-Reference (PDF 2938 KB)