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SN74LVC2G07-EP 具有漏极开路输出的增强型产品单路缓冲器/驱动器

SN74LVC2G07-EP
Pin/Package 6SC70
Operating Temperature Range(°C) -55 to 125
IOL(mA) 24
Voltage Nodes(V) 5
IOH(mA) 24
Input Level LV TTL
Static Current 10uA
Output Drive(mA) +24,-24
Vcc max(V) 5
Technology Family LVC
Vcc min(V) 1.65
Output Level LV TTL
No. of Gates 2
Vcc range(V) 5.5
tpd max(ns) 5.7
ICC(uA) 10
Voltage Node(V) 3.3
Rating HiRel Enhanced Product
SN74LVC2G07-EP 特性
SN74LVC2G07-EP 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
74LVC2G07MDCKTEPG4 ACTIVE -55 to 125 1.04 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74LVC2G07MDCKTEP ACTIVE -55 to 125 1.04 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
V62/08616-01XE ACTIVE -55 to 125 1.04 | 1ku SC70 (DCK) | 6 250 | SMALL T&R  
SN74LVC2G07-EP 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
74LVC2G07MDCKTEPG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 74LVC2G07MDCKTEPG4 74LVC2G07MDCKTEPG4
SN74LVC2G07MDCKTEP Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74LVC2G07MDCKTEP SN74LVC2G07MDCKTEP
V62/08616-01XE Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM V62/08616-01XE V62/08616-01XE
SN74LVC2G07-EP 应用技术支持与电子电路设计开发资源下载
  1. SN74LVC2G07-EP 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)