This single D-type latch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
While the latch-enable (LE) input is high, the Q output follows the data (D) input. When LE is taken low, the Q output is latched at the logic level set up at the D input.
NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package.
OE does not affect the internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state.
A buffered output-enable (OE) input can be used to place the output in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the output neither loads nor drives the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down
| SN74LVC1G373 | |
| Pin/Package | 6DSBGA, 6SC70, 6SOT-23 |
| Operating Temperature Range(°C) | -40 to 85 |
| IOL(mA) | 32 |
| IOH(mA) | -32 |
| Input Level | CMOS |
| Vcc max(V) | 5.5 |
| Technology Family | LVC |
| Vcc min(V) | 1.65 |
| Approx. Price (US$) | 0.13 | 1ku |
| Output Level | CMOS |
| No. of Gates | 1 |
| tpd max(ns) | 3.5 |
| ICC(uA) | 10 |
| 器件 | 状态 | 温度 | 价格（美元） | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
| SN74LVC1G373DBVR | ACTIVE | -40 to 85 | 0.13 | 1ku | SOT-23 (DBV) | 6 | 3000 | LARGE T&R | |
| SN74LVC1G373DCKR | ACTIVE | -40 to 85 | 0.13 | 1ku | SC70 (DCK) | 6 | 3000 | LARGE T&R | |
| SN74LVC1G373YZPR | ACTIVE | -40 to 85 | 0.28 | 1ku | DSBGA (YFF) | 6 | 3000 | LARGE T&R |
| 器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
| SN74LVC1G373DBVR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC1G373DBVR | SN74LVC1G373DBVR |
| SN74LVC1G373DCKR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LVC1G373DCKR | SN74LVC1G373DCKR |
| SN74LVC1G373YZPR | Green (RoHS & no Sb/Br) | SNAGCU | Level-1-260C-UNLIM | SN74LVC1G373YZPR | SN74LVC1G373YZPR |