SN74LVC1G19 2 选 1 解码器/多路解复用器

This decoder/demultiplexer is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G19 is a 1-of-2 decoder/demultiplexer. This device buffers the data on input A and passes it to the outputs Y0 (true) and Y1 (complement) when the enable (E) input signal is low.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

NanoFreeTM package technology is a major breakthrough in IC packaging concepts, using the die as the package

	SN74LVC1G19
No. of Gates	1
tpd max(ns)	2.8
Pin/Package	6DSBGA, 6SC70, 6SOT-23
IOH(mA)	-32
IOL(mA)	32
Vcc min(V)	1.65
Vcc max(V)	5.5
Approx. Price (US$)	0.13 | 1ku
Operating Temperature Range(°C)	-40 to 85
Technology Family	LVC
ICC(uA)	10

SN74LVC1G19 特性

• Available in the Texas Instruments NanoFreeTM Package
• Supports 5-V VCC Operation
• Inputs Accept Voltages to 5.5 V
• Max tpd of 4 ns at 3.3 V
• Low Power Consumption, 10-uA Max ICC
• ±24-mA Output Drive at 3.3 V
• VOLP (Output Ground Bounce) <0.8 V Typat VCC = 3.3 V, TA = 25°C
• VOHV (Output VOH Undershoot) >2 V Typ at VCC = 3.3 V, TA = 25°C
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

SN74LVC1G19 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74LVC1G19DBVR	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G19DBVRE4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G19DBVRG4	ACTIVE	-40 to 85	0.13 | 1ku	SOT-23 (DBV) | 6	3000 | LARGE T&R
SN74LVC1G19DCKR	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G19DCKRE4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G19DCKRG4	ACTIVE	-40 to 85	0.13 | 1ku	SC70 (DCK) | 6	3000 | LARGE T&R
SN74LVC1G19YZPR	ACTIVE	-40 to 85	0.23 | 1ku	DSBGA (YFF) | 6	3000 | LARGE T&R

SN74LVC1G19 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74LVC1G19DBVR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G19DBVR	SN74LVC1G19DBVR
SN74LVC1G19DBVRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G19DBVRE4	SN74LVC1G19DBVRE4
SN74LVC1G19DBVRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G19DBVRG4	SN74LVC1G19DBVRG4
SN74LVC1G19DCKR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G19DCKR	SN74LVC1G19DCKR
SN74LVC1G19DCKRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G19DCKRE4	SN74LVC1G19DCKRE4
SN74LVC1G19DCKRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LVC1G19DCKRG4	SN74LVC1G19DCKRG4
SN74LVC1G19YZPR	Green (RoHS & no Sb/Br)	SNAGCU	Level-1-260C-UNLIM	SN74LVC1G19YZPR	SN74LVC1G19YZPR

SN74LVC1G19 应用技术支持与电子电路设计开发资源下载

1. SN74LVC1G19 数据资料 dataSheet 下载.PDF
2. TI 德州仪器小尺寸逻辑器件产品选型与价格 . xls
3. Logic Guide 2009 (PDF 4263 KB)
4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
9. Designing With Logic (PDF 186 KB)
10. Live Insertion (PDF 150 KB)
11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. LOGIC Pocket Data Book (PDF 6001 KB)
15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
16. Logic Cross-Reference (PDF 2938 KB)