SN74LV08A | |
Rating | Catalog |
Technology Family | LVC |
器件 | 状态 | 温度 | 价格 | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
SN74LV08AD | ACTIVE | -40 to 85 | 0.24 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
SN74LV08ADE4 | ACTIVE | -40 to 85 | 0.24 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
SN74LV08ADG4 | ACTIVE | -40 to 85 | 0.24 | 1ku | SOIC (D) | 14 | 50 | TUBE | |
SN74LV08ADR | ACTIVE | -40 to 85 | 0.20 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
SN74LV08ADRE4 | ACTIVE | -40 to 85 | 0.20 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
SN74LV08ADRG4 | ACTIVE | -40 to 85 | 0.20 | 1ku | SOIC (D) | 14 | 2500 | LARGE T&R | |
SN74LV08AN | ACTIVE | -40 to 85 | 0.22 | 1ku | PDIP (N) | 14 | 25 | TUBE | |
SN74LV08ANE4 | ACTIVE | -40 to 85 | 0.22 | 1ku | PDIP (N) | 14 | 25 | TUBE |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
SN74LV08AD | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LV08AD | SN74LV08AD |
SN74LV08ADE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LV08ADE4 | SN74LV08ADE4 |
SN74LV08ADG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LV08ADG4 | SN74LV08ADG4 |
SN74LV08ADR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LV08ADR | SN74LV08ADR |
SN74LV08ADRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LV08ADRE4 | SN74LV08ADRE4 |
SN74LV08ADRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74LV08ADRG4 | SN74LV08ADRG4 |
SN74LV08AN | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | SN74LV08AN | SN74LV08AN |
SN74LV08ANE4 | Pb-Free (RoHS) | CU NIPDAU | N/A for Pkg Type | SN74LV08ANE4 | SN74LV08ANE4 |