SN74LS166A 串行输出移位寄存器

	SN74LS166A
Technology Family	LS
Rating	Catalog

SN74LS166A 芯片订购指南

器件	状态	温度	价格	封装 | 引脚	封装数量 | 封装载体	丝印标记
SN74LS166AD	ACTIVE	0 to 70	0.45 | 1ku	SOIC (D) | 16	50 | TUBE
SN74LS166ADE4	ACTIVE	0 to 70	0.45 | 1ku	SOIC (D) | 16	50 | TUBE
SN74LS166ADG4	ACTIVE	0 to 70	0.45 | 1ku	SOIC (D) | 16	50 | TUBE
SN74LS166ADR	ACTIVE	0 to 70	0.37 | 1ku	SOIC (D) | 16	2500 | LARGE T&R
SN74LS166ADRE4	ACTIVE	0 to 70	0.37 | 1ku	SOIC (D) | 16	2500 | LARGE T&R
SN74LS166ADRG4	ACTIVE	0 to 70	0.37 | 1ku	SOIC (D) | 16	2500 | LARGE T&R
SN74LS166AJ	OBSOLETE	0 to 70		CDIP (J) | 16	25 | TUBE
SN74LS166AN	ACTIVE	0 to 70	0.41 | 1ku	PDIP (N) | 16
SN74LS166AN3	OBSOLETE	0 to 70		PDIP (N) | 16	25 | TUBE
SN74LS166ANE4	ACTIVE	0 to 70	0.41 | 1ku	PDIP (N) | 16	2000 | LARGE T&R
SN74LS166ANSR	ACTIVE	0 to 70	0.41 | 1ku	SO (NS) | 16	2000 | LARGE T&R
SN74LS166ANSRG4	ACTIVE	0 to 70	0.41 | 1ku	SO (NS) | 16	2000 | LARGE T&R

SN74LS166A 质量与无铅数据

器件	环保计划*	铅/焊球涂层	MSL 等级/回流焊峰	环保信息与无铅 (Pb-free)	DPPM / MTBF / FIT 率
SN74LS166AD	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166AD	SN74LS166AD
SN74LS166ADE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ADE4	SN74LS166ADE4
SN74LS166ADG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ADG4	SN74LS166ADG4
SN74LS166ADR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ADR	SN74LS166ADR
SN74LS166ADRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ADRE4	SN74LS166ADRE4
SN74LS166ADRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ADRG4	SN74LS166ADRG4
SN74LS166AN	Pb-Free (RoHS)	CU NIPDAU	N/A for Pkg Type	SN74LS166AN	SN74LS166AN
SN74LS166ANE4	Pb-Free (RoHS)	CU NIPDAU	N/A for Pkg Type	SN74LS166ANE4	SN74LS166ANE4
SN74LS166ANSR	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ANSR	SN74LS166ANSR
SN74LS166ANSRE4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ANSRE4	SN74LS166ANSRE4
SN74LS166ANSRG4	Green (RoHS & no Sb/Br)	CU NIPDAU	Level-1-260C-UNLIM	SN74LS166ANSRG4	SN74LS166ANSRG4

SN74LS166A 应用技术支持与电子电路设计开发资源下载

1. TI 德州仪器触发器/锁存器/寄存器产品选型与价格 . xls
2. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
3. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
4. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
5. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
6. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
7. Designing With Logic (PDF 186 KB)
8. Live Insertion (PDF 150 KB)
9. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
10. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
11. HiRel Unitrode Power Management Brochure (PDF 206 KB)
12. LOGIC Pocket Data Book (PDF 6001 KB)
13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
14. Logic Cross-Reference (PDF 2938 KB)