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SN74HCT257 具有三态输出的四路 2 线路至 1 线路数据选择器/多路复用器

The ’HCT257 devices are designed to multiplex signals from 4-bit data sources to 4-output data lines in bus-organized systems. The 3-state outputs do not load the data lines when the output-enable (OE)\ input is at the high logic level.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver

SN74HCT257
Rating Catalog
Technology Family HCT
SN74HCT257 特性
SN74HCT257 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74HCT257D ACTIVE 0 to 70 0.95 | 1ku SOIC (D) | 16 40 | TUBE  
SN74HCT257DE4 ACTIVE 0 to 70 0.95 | 1ku SOIC (D) | 16 40 | TUBE  
SN74HCT257DG4 ACTIVE 0 to 70 0.95 | 1ku SOIC (D) | 16 40 | TUBE  
SN74HCT257DR ACTIVE 0 to 70 0.80 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN74HCT257DRE4 ACTIVE 0 to 70 0.80 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN74HCT257DRG4 ACTIVE 0 to 70 0.80 | 1ku SOIC (D) | 16 2500 | LARGE T&R  
SN74HCT257N ACTIVE 0 to 70 0.90 | 1ku PDIP (N) | 16 25 | TUBE  
SN74HCT257NE4 ACTIVE 0 to 70 0.90 | 1ku PDIP (N) | 16 25 | TUBE  
SN74HCT257 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74HCT257D Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT257D SN74HCT257D
SN74HCT257DE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT257DE4 SN74HCT257DE4
SN74HCT257DG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT257DG4 SN74HCT257DG4
SN74HCT257DR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT257DR SN74HCT257DR
SN74HCT257DRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT257DRE4 SN74HCT257DRE4
SN74HCT257DRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74HCT257DRG4 SN74HCT257DRG4
SN74HCT257N Pb-Free (RoHS) CU NIPDAU N/A for Pkg Type SN74HCT257N SN74HCT257N
SN74HCT257NE4 Pb-Free (RoHS) CU NIPDAU N/A for Pkg Type SN74HCT257NE4 SN74HCT257NE4
SN74HCT257 应用技术支持与电子电路设计开发资源下载
  1. SN74HCT257 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器MSI 功能产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. Shelf-Life Evaluation of Lead-Free Component Finishes (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)