This bus-termination array is designed to reduce reflection noise and minimize ringing on high-performance bus lines. The SN74F1016 features a 16-bit R-C network and Schottky barrier diode array. These Schottky diodes provide clamp-to-ground functionality and serve to minimize overshoot and undershoot of high-speed switching buses.
The SN74F1016 is characterized for operation from 0°C to 70°C
SN74F1016 | |
Depth | 16 |
Width | 5 |
Fmax(MHz) | 10 |
Technology Family | F |
器件 | 状态 | 温度 | 价格(美元) | 封装 | 引脚 | 封装数量 | 封装载体 | 丝印标记 |
SN74F1016DW | ACTIVE | 0 to 70 | 5.10 | 1ku | SOIC (DW) | 20 | 25 | TUBE | |
SN74F1016DWE4 | ACTIVE | 0 to 70 | 5.10 | 1ku | SOIC (DW) | 20 | 25 | TUBE | |
SN74F1016DWG4 | ACTIVE | 0 to 70 | 5.10 | 1ku | SOIC (DW) | 20 | 25 | TUBE | |
SN74F1016DWR | ACTIVE | 0 to 70 | 4.25 | 1ku | SOIC (DW) | 20 | 2000 | LARGE T&R | |
SN74F1016DWRE4 | ACTIVE | 0 to 70 | 4.25 | 1ku | SOIC (DW) | 20 | 2000 | LARGE T&R | |
SN74F1016DWRG4 | ACTIVE | 0 to 70 | 4.25 | 1ku | SOIC (DW) | 20 | 2000 | LARGE T&R |
器件 | 环保计划* | 铅/焊球涂层 | MSL 等级/回流焊峰 | 环保信息与无铅 (Pb-free) | DPPM / MTBF / FIT 率 |
SN74F1016DW | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F1016DW | SN74F1016DW |
SN74F1016DWE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F1016DWE4 | SN74F1016DWE4 |
SN74F1016DWG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F1016DWG4 | SN74F1016DWG4 |
SN74F1016DWR | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F1016DWR | SN74F1016DWR |
SN74F1016DWRE4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F1016DWRE4 | SN74F1016DWRE4 |
SN74F1016DWRG4 | Green (RoHS & no Sb/Br) | CU NIPDAU | Level-1-260C-UNLIM | SN74F1016DWRG4 | SN74F1016DWRG4 |