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SN74CBTLV3383 低电压 10 位 FET 总线交换开关

The SN74CBTLV3383 provides ten bits of high-speed bus switching or exchanging. The low on-state resistance of the switch allows connections to be made with minimal propagation delay.

The device operates as a 10-bit bus switch or as a 5-bit bus exchanger, which provides swapping of the A and B pairs of signals. The bus-exchange function is selected when BX is high, and BE\ is low.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off

SN74CBTLV3383
Voltage Nodes(V) 3.3, 2.5
Vcc range(V) 2.3 to 3.6
ron(max)(ohms) 7
tpd max(ns) 0.25
Rating Catalog
Technology Family CBTLV
SN74CBTLV3383 特性
SN74CBTLV3383 芯片订购指南
器件 状态 温度 价格 封装 | 引脚 封装数量 | 封装载体 丝印标记
SN74CBTLV3383DW ACTIVE -40 to 85 0.48 | 1ku SOIC(DW) | 24 40 | TUBE  
SN74CBTLV3383DWE4 ACTIVE -40 to 85 0.48 | 1ku SOIC(DW) | 24 40 | TUBE  
SN74CBTLV3383DWG4 ACTIVE -40 to 85 0.48 | 1ku SOIC(DW) | 24 40 | TUBE  
SN74CBTLV3383DWR ACTIVE -40 to 85 0.40 | 1ku SOIC(DW) | 24 2500 | LARGE T&R  
SN74CBTLV3383DWRE4 ACTIVE -40 to 85 0.40 | 1ku SOIC(DW) | 24 2500 | LARGE T&R  
SN74CBTLV3383DWRG4 ACTIVE -40 to 85 0.40 | 1ku SOIC(DW) | 24 2500 | LARGE T&R  
SN74CBTLV3383 质量与无铅数据
器件 环保计划* 铅/焊球涂层 MSL 等级/回流焊峰 环保信息与无铅 (Pb-free) DPPM / MTBF / FIT 率
SN74CBTLV3383DW Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3383DW SN74CBTLV3383DW
SN74CBTLV3383DWE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3383DWE4 SN74CBTLV3383DWE4
SN74CBTLV3383DWG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3383DWG4 SN74CBTLV3383DWG4
SN74CBTLV3383DWR Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3383DWR SN74CBTLV3383DWR
SN74CBTLV3383DWRE4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3383DWRE4 SN74CBTLV3383DWRE4
SN74CBTLV3383DWRG4 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM SN74CBTLV3383DWRG4 SN74CBTLV3383DWRG4
SN74CBTLV3383 应用技术支持与电子电路设计开发资源下载
  1. SN74CBTLV3383 数据资料 dataSheet 下载.PDF
  2. TI 德州仪器信号开关产品选型与价格 . xls
  3. Logic Guide 2009 (PDF 4263 KB)
  4. 防止模拟开关的额外功耗 (PDF 392 KB) (PDF 1305 KB)
  5. Understanding and Interpreting Standard-Logic Data Sheets (PDF 857 KB)
  6. TI IBIS File Creation, Validation, and Distribution Processes (PDF 380 KB)
  7. Implications of Slow or Floating CMOS Inputs (PDF 101 KB)
  8. CMOS Power Consumption and CPD Calculation (PDF 89 KB)
  9. Designing With Logic (PDF 186 KB)
  10. Live Insertion (PDF 150 KB)
  11. Input and Output Characteristics of Digital Integrated Circuits (PDF 1708 KB)
  12. Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc (PDF 43 KB)
  13. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  14. LOGIC Pocket Data Book (PDF 6001 KB)
  15. HiRel Unitrode Power Management Brochure (PDF 206 KB)
  16. Logic Cross-Reference (PDF 2938 KB)